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波峰焊接的新途径与无铅转换
By Martin Theriault, P.Eng. and Armin Rahn,
Ph.D.
本文介绍，一种基于电磁学的技术提供节约成本的无铅波峰焊接。
References
- Baggio, T. and K. Suetsugu. 1999. Guidelines for lead-free processing, SMT, September.
- Kenyon, W. 1998. Potential impact of lead-free solders on cleaning, SMT, November.
- Hunt, C., et al. 2002. Evalution of the comparative soldering of lead-free solders in nitrogen, Proceedings of APEX 2002.
Martin Theriault is global market manager of electronics manufacturing with Air Liquide America Corp., Houston, TX; e-mail:
martin.theriault@airliquide.com.
Armin Rahn is principal with Rahn-Tec Consultants, St. Catherines, Ontario, Canada; e-mail:
rahn@vaxxine.com.
(Presented by Aaron 04/16/2002)
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