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By Ajay P. Malshe 本文介绍，晶圆级封装工艺使得封装成为元件的不容置疑的一个部分。 Ajay P. Malshe, associate professor at the Department of Mechanical Engineering and adjunct faculty at the High Density Electronics Center (HiDEC), can be contacted at the University of Arkansas, Fayetteville, AR 72701; 501-575-6561; Fax: 501-575-6982; E-mail: apm2@engr.uark.edu. (Presented by Aaron 06/27/2002)
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