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返修与返工的要求
By Ray P. Prasad

  本文介绍,那些允许表面贴装元件之间相互间隔紧,同时提供实时自动温度作图的返修系统将胜人一筹。

  现在讨论一下通用的返修要求,不管使用什么返修工艺或设备。

  

    References:
  1. Prasad, Ray P., "Contributing factors for thermal damage in PWB assmblies during hand soldering." IPC Technical Review, Jan. 1982, pp. 9-17.

  RAY P. PRASAD is an SMT Editorial Advisory Board member and author of the textbook Surface Mount Technology: Principles and Practice. Additionally, he is president of BeamWorks Inc., a supplier of automated mass rework and selective assembly systems, located in Portland, OR, and founder of the Ray Prasad Consultancy Group, which specializes in helping companies establish strong internal SMT infrastructure. Contact him at P.O. Box 219179, Portland, OR 97225; (503) 297-5898 or (503) 646-3224; Fax: (503) 297-0330; Web site: www.rayprasad.com.

(Presented by Aaron 02/21/2002)

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