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Quad APS-1ä Advanced Packaging System
Capability highlights:
- COB, FCOB, FCOF, CSP, MCM and SMT assembly
- High production throughputs
-
± 0.0005” @±
3 std. Deviation precision placement
- Modular system to meet current and future requirements
Optional Equipment Highlights:
- Wafer presentation
- Waffle pack presentation
- Input/output magazine
- Heated die
- Flux pot
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