Job
description
Company: Seagate
Title: Assembly/Process
Engineer
Location:
A. Qualification:
1. Degree in Mechanical/Electronics
Engineering or Diploma in Mechanical Engineering
2. 5 years working experience in Surface Mount
Technology Industry.
B. Working
experience: The candidate must be equipped with Surface Mount
Technology experience, knowledge of the SMT process
development will be
added advantage.
SMT machine maintenance knowledge such as pick and
place/mounting, reflow oven,
and screening printer
equipment will be the key
requirement for the position.
C.
Details
of the machine operating experience:
I.
Screen
Printing
a)
Top up
cleaning agent and change wiping paper
b)
Replace
solder paste cartridge
c)
Collect
and replenish raw-card to the line
d)
Trouble-shoot,
repair machine problem and etc
e)
Shovel
solder paste on stencil / clean stencil
f)
Post
screen printing inspection
g)
Buffering boards before paste top up,
paste scooping and paper changing
h)
Monitor
machine performance and hourly output
i)
Perform
misprinted board cleaning on batch cleaner
j)
Solder
paste height check (once a shift)
k)
Plot
SPC chart and calculation of upper and lower control limit
l)
Raise
quality alert if encountered paste height off specification
m) Perform weekly TPM activities
II. FCM
a) Material reel splicing
b) Trouble-shoot and repair machine problems
c) Cutting of material waste tape
d) Replacement of laser nozzle when detected
faulty
e) Monitoring of parts status and prepare for
part change when necessary
f)
Handle
boards jammed, dropped, misalign, machine error, etc.
g) Monitor machine recovery status
h) Check on high recovery feeders and replace
if necessary
i)
Monitor
machine performance and hour output
j)
Perform
weekly TPM activities
III. Siplace
a) Material reel splicing / Tray change / Tray
part preparation
b) Trouble-shoot and repair machine problem
c) Replacement of nozzle when detected faulty
d) Monitoring of machine parts status and
prepare for part change when necessary
e) Monitor machine recovery status, check on
high recovery feeders and replace if necessary
f)
Monitor
machine performance and machine hourly output
g) Perform weekly TPM activities
Job
description
Company: Seagate
Title: Failure
Analysis Engineer
Location:
A. Qualification:
1. Education : Minimum B Engineering From a
Respectable University
2. With 2 years of experience performing FA or
Product Engineering at a PCBA level on similarly complex circuits.
D.
Language
Proficiency
Able to speak, understand and write English well. Able
to read and
understand internal Seagate specs and Supplier's spec. Is able
to
communicate with the design center in English.
E.
Key
Skills Needed
Proficient in using Oscilloscope, Logic Analyser, IV curve tracers and
IDE/SCSI Analyzers.
F.
Good
Working Knowledge
a)
of how mictoprocessors work.
b)
of how
firmware and software interacts
c)
circuit
analysis approach
d)
material
analysis approach with capabilities in CSAM, SEM/EDX,
e)
decapsulation, Xrays,
X-section, Hot spot analysis.
f)
Knowleagble in PCBA process.
Job
description
Company: Seagate
Title: ICT/Hardware
Engineer
Location:
A. Qualification:
3. Prefer to degree in Electrical &
Electronic Engineering /Mechantronic
Knowledge of System:
a) Teradyne Test Station TS-128 (GR-2280S)
b) ICT fixture, Pneumatic application &
Automate handler
G.
Details
of ICT Engineering Job Scope/experience
Responsible to lead a team of technical staff to
upkeep the fixtures &
systems
a)
Buy-off
of system (new off-line & in-line) & Fixture Acceptance Check
b)
Provide
daily technical & follow-up on
RCA to closure
c)
Control
of software release from Central to line
d)
ECO
update for ICT fixture
e)
Trainer
for ICT hardware
f)
Hardware
Repairs / Troubleshooting
g)
Spare
parts / Inventory Control
h)
Calibration
/ Preventive maintenance
Job
description
Company: Seagate
Title: Program/PLM
Engineer
Location:
A. Qualification:
4. Degree in Mechanical/Electronics
Engineering or Diploma in Mechanical Engineering
5. 5 years working experience in product
transfer from design stage to production stage
B. Working
experience: The candidate must be equipped with Surface Mount Technology
experience, knowledge of the disc drive technology will be
added advantage. He or She must be able to communicate to
all level staffs
coordinate the product transfer program from design
stage to EOL.
H.
Details
of the program engineer job scope/experience
a)
Coordinate
PCBA build to meet drive plant, design center demand
b)
Follow
QSR to manage PCBA through its entire life
c)
Present
both in English and Mandarin to management on product development
d)
Make
decision in the interest of the company
e)
Liaison
with various departments both locally and overseas
f)
Initiate
and conduct meetings to address issues and ensure corrective actions
implemented
g)
Update
and write product status report
h)
Maintain
and keep track of products history
Job
description
Company: Seagate
Title: Viscom Engineer
Location:
B. Qualification:
1. Bachelor of Engineering or Computer Science
2. Prefer one year experience in handling
Optical Vision or Test Equipment
C. Software
1. Familiarise with WinNT Operating System (OS)
2. Writing of batch or macro file
3. Basic programming skill in C++
4. Basic knowledge of Microsoft Networking
environment, e.g. TCP/IP
D. Hardware
1. Basic knowledge of optical vision technology,
camera system, optical lens and LED lighting illumination
2. Trouble-shooting skill for electronic component,
e.g. sensor, switches
and power supply
E. Job Scope
i)
Responsible
to lead a team of technical staff to operate the AOI machine
j)
Buy-off
of system (new offlines & inline) and new test
plan released from programmer
k)
Provide
daily technical & follow up on
RCA to closure
l)
Control
of libraries released from Central (AMK,
m)
Trainer
for the machine to technical team
n)
Hardware
repairs /troubleshooting
o)
Assist
in calibration /preventive maintenance