 |
|
WMA-SMQâ 65 Solder Paste Halide-free, Robust, Air Reflow, Water-Soluble
INTRODUCTION
WMA-SMQâ 65 is the latest robust Water-Soluble, halide-free solder paste system designed for demanding electroncs assembly processed. This product is a mildly activated, air reflow solder paste with exceprional wetting capabilities. WMA-SMQâ 65 accommodates a broad range of environmental processing conditions, from low to high relative humidity. It meets J-STD-004 and –005 criteria as well as Beelcore, ANSI/IPC-SF-818/SP-819 and Mil-P-28809 specifications, and accordingly ensures high reliability performance.
AVAILABLE ALLOYS
Solder pastes are made from low-oxide, spherical powder composed of Sn-Pb, Sn-Pb-Ag and other alloys. Powder for fine pitch and ultra fine pitch (-325/+500 and –400/+500 mesh) for printing and dispensing applications down to 0.012”/0.305mm is available in addition to powder for standard pitch (-200/+325 mesh). Typical metal loads may range from 86% to 90% with actual % dependent on the alloy and application. Please call our technical staff for advice on non-standard compositions.
PRODUCT HANDLING RECOMMENDATIONS
PRINTING
Stencil Material: Stainless Steel, Brass or Nickel Plated.
STENCIL THICKNESS
|
0.050”/1.27mm pitch |
0.010”/0.254mm to 0.008”/0.203mm |
|
0.025”/0.64mm pitch |
0.008”/0.203mm to 0.006”/0.152mm |
|
0.020”/0.51mm pitch |
0.006”/0.152mm to 0.004”/0.102mm |
|
0.016”/0.41mm pitch |
0.005”/0.127mm to 0.004”/0.102mm |
|
0.012”/0.31mm pitch |
0.004”/0.102mm to 0.003”/0.076mm |
Squeegee:
80 to 90 shore A durameter
Rubber or Stainless Steel Blade
Squeegee Speed:
0.5”/12.7mm to 2.0”/50.8mm per second recommended. Higher speeds may also be utilized.
Squeegee pressure
1.0lb to 1.5lb per inch squeegee length.
1.78N to 2.68N per cm squeegee length.
REFLOW
Methods: IR, Vapor Phase, Convection, Conduction, Laser, etc.
Recommended Profile:
(This profile is for Sn63Pb37. It can be adjusted to accommodate various board geometries. Adequate preheat is essential to optimum soldering performance.)
CLEANING
The residue is easily cleaned with plain water at no less than 40psi and 55° C. these parameters are, of course, a function of board complexity and cleaner efficiency.
Stencil cleaning is best performed using plain hot water. Cleaning in any of the commercial stencil cleaners or isopropyl alcohol is also effective.
SHELF LIFE, STORAGE AND USE
6 months at –10 to 25° C(recommended storage condition)
The paste is suitable for refrigerated storage. The paste must be warmed to room temperature before use. Actual time to reach thermal equilibrium is dependent upon container size. In order to maximize the opened-jar paste performance, the paste container should be covered when not in use.
TECHNICAL INFORMATION
J-STD-004 (IPC-TM-650)
|
Test |
Result |
|
Flux Type Classification |
M0 |
|
Acid Value |
73 |
|
Flux Induced Corrosion (Copper Mirror) |
Pass |
|
Presence of Halide Silver Chromate Elemental Analysis (Br, Cl, F) Fluoride Spot Test |
Pass 0% Pass |
|
Non-Volatile Content |
86% |
|
Post Reflow Residue |
N/A |
|
Paste Flux Viscosity |
6000 poises |
|
Suface Insulation Resistance Test |
Pass |
J-STD-005 (IPC-TM-650)
|
Test |
Result |
|
Solder Paste Viscosity: Brookfield (Sn63, 90%, -325/+500 mesh) (Sn62, 90%, -325/+500 mesh) Malcom (10rpm) |
950 ± 100 Kcps 850 ± 100 Kcps 3300 ± 500 poises |
|
Shear Sensitivity Factor |
-0.39 ± 0.07 |
|
Slump Test |
Pass |
|
Solder Ball Test |
Pass |
|
Wetting Test |
Pass |
|
Tackiness |
37g |
SIR Test Results
Electromigration Test Result
Tack vs. Time Data
信息与建议: webmaster@smtinline.com
© 2000 SMTinLine. All rights reserved.