Amkor Technology Offers ExposedPad(TM) LQFP
For Greater Power and Thermal Performance

Chandler, Ariz., ¨C Amkor Technology (Nasdaq - AMKR) has expanded its family of low profile quad flat pack IC packages to include an exposed pad configuration in 20x20, 24x24 and 28x28 mm form factors.

The ExposedPad(TM) LQFP provides up to 60 percent increased power and enhanced thermal performance for cost-effective applications requiring high speed, low loop inductance and short path to ground in a low profile package. Such applications include laptop computers, office equipment, disk drives, communications boards, audio/visual devices and data acquisition devices. Amkor achieved the enhanced thermal characteristics by deepening the down-set of the die, allowing the exposed pad to be soldered to the printed circuit board.

"We developed the package to provide enhanced thermal performance but soon found our customers also wanting it for its superior electrical characteristics," said Don Foster, manager of the TQFP product line for Amkor.

ExposedPad LQFP packages have lead counts ranging from 176 in the 20x20 form factor to 256 in the 28x28. The package is 1.4 mm thick.

About Amkor Technology: Amkor Technology, Inc. is the world's largest provider of contract microelectronics manufacturing solutions. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services, including deep sub-micron wafer fabrication; wafer probe, wafer mapping, characterization and reliability testing; IC packaging design and assembly; multi-chip module design and assembly; and final testing. More information on Amkor is available from the company's SEC filings and on Amkor's web site: www.amkor.com.

For more information, contact:
Annie Ho
Always Communications
(852) 2855-7819
annieh@agrapha-group.com

Ken Jensen
Director Marketing Communications
1(480) 821-2408 Ext. 5130
kjens@amkor.com