AMKOR TECHNOLOGY, SHINKO SIGN JOINT DEVELOPMENT
AND CROSS-LICENSING AGREEMENT

Two major suppliers to the semiconductor industry are combining forces on joint product development and cross licensing of existing assembly and packaging patents.

The two-year agreement brings Amkor Technology (Nasdaq - AMKR), the largest provider of contract assembly and test services, together with Shinko Electric Industries Co., Ltd., one of Japan's leading manufacturers of semiconductor packages. Through joint development activities and by granting access to each other's patents and technology, the agreement gives each company a competitive advantage in their respective markets.

The agreement provides significant benefits to the customers of both companies, including access to a greatly expanded patent portfolio, the opportunity to evaluate new packaging and assembly processes and materials, and exclusivity on new materials.

"The agreement is important because through joint development, both Shinko and Amkor will have access to the latest in materials and assembly technology," said Richard Groover, vice president of flip chip development for Amkor. "Our customers will see their products getting to market faster and with increased performance."

Using Amkor's expertise in assembly and test and Shinko's proficiency in materials, the companies will work on development of laminate and leadframe products, as well as flip chip and other advanced technologies, including the use of lead- and halide-free materials.

"Close cooperation between Shinko and the semiconductor assembly and test services provided by Amkor is paramount to meet both our customers' current and future requirements," said Sugio Uchida, executive managing director of Shinko. "It is exciting to know that by having access to an expanded patent portfolio and through joint development, we will be able to lead the semiconductor packaging industry and achieve greater customer satisfaction," said Uchida.

Through cross-licensing of new and existing patents, both companies receive increased protection for their products and processes.

"As Amkor expands in the Japanese market, we see a strategic relationship with Shinko as highly beneficial to our long-term growth in that market," Groover said. Amkor recently established a joint venture assembly and test operation in Japan.

About Amkor Technology: Amkor Technology, Inc. is the world's largest provider of contract microelectronics manufacturing solutions. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services, including deep sub-micron wafer fabrication; wafer probe, wafer mapping, characterization and reliability testing; IC packaging design and assembly; multi-chip module design and assembly; and final testing. More information on Amkor is available from the company's SEC filings and on Amkor's web site: www.amkor.com.

About Shinko Electric Industries Co., Ltd.: Shinko Electric Industries Co., Ltd. was founded in Nagano, Japan in 1946. Shinko is an all round manufacturer of semiconductor packages, notably leadframe and PLP (Plastic Laminated Package), and recognized as a leader in the industry. More information on Shinko is available on Shinko's web site: www.shinko.co.jp

For more information, contact:

Annie Ho
Always Communications
(852) 2855-7819
AnnieH@Agrapha-group.com

Ken Jensen
Director Marketing Communications
1(480) 821-2408 Ext. 5130
kjens@amkor.com

Shinko - President
Greg Bettencourt (US Contact)
1-(408) 232-0499
g.bettencourt@shinko.com

Shinko - Deputy General Manager
Shuji Eguchi (Japan Contact)
(81) 26-283-1000
shuji_eguchi@mail.shinko.co.jp