AMKOR FLIP CHIP ON LEADFRAME PACKAGE TOPS WIRE BONDS FOR HIGH
FREQUENCY PERFORMANCE IN 5 TO 20 GHz APPLICATIONS

Amkor Technology's (Nasdaq - AMKR) new flip chip on MicroLeadFrame(TM) (fcMLF) package design for high-frequency applications provides electrical performance superior to wire bond packages.

The package features a very short interconnect distance between the die bump pads and the motherboard, resulting in reduced insertion loss, inductance and parasitics. The design incorporates the industry's first combination of an 8-mil leadframe and 200-¦Ìm flip chip ball- pitch.

The design is expected to be in demand for applications requiring a frequency range of 5 to 20 GHz and lead counts of less than 100 I/O. These applications include controllers, power amplifiers and other communication devices needed for high frequency networks or wireless applications. fcMLF devices also will be available in a lead-free option.

The design allows package engineers to place large die in a smaller than normal footprint because there is no periphery space needed for wire bonding. While the initial package offering incorporates flip chip with the micro leadframe design, Amkor expects to adapt additional packages to the flip chip leadframe form factor.

Additionally, Amkor supports customers with electrical and thermal modeling, enabling analysis of the combination of die and leadframe performance to validate that the final product meets application requirements for all parameters.

Two "alpha" customers will begin receiving fcMLF packages this month for evaluation. High volume manufacturing is expected to begin during the fourth quarter of 2001.

About Amkor Technology: Amkor Technology, Inc. is the world's largest provider of contract microelectronics manufacturing solutions. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services, including deep sub-micron wafer fabrication; wafer probe, wafer mapping, characterization and reliability testing; IC packaging design and assembly; multi-chip module design and assembly; and final testing. More information on Amkor is available from the company's SEC filings and on Amkor's web site: www.amkor.com.

For more information, contact:

Annie Ho
Always Communications
(852) 2855-7819
AnnieH@Agrapha-group.com

Ken Jensen
Director Marketing Communications
1(480) 821-2408 Ext. 5130
kjens@amkor.com