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SMT in Line
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Provide Microwave Plasma systems for Cleaning.
Tepla Inc.
Stephen K. Wilson
Carrollton, Texas
442-190
United States
714-832-3113
714-832-4227
swtepla@attglobal.net
http://www.tepla.cc
06/19/2001
Company Description:
Prior to Wire Bonding
Prior to Attach
Prior to Underfill
Improves yield of chips by dramatically increasing bond strengths.