Product Category>>Adhesive:
AI Technology, Inc. Reliable IC-Packaging.
Dow Corning 3165 Fast Tack RTV Adhesive/Sealant.
Eastman Chamical Company Thermx® PCT, PET and LCP polysters
Emerson & Cuming a National Starch & Chemical Company underfiles, solder alternatives, c.o.b materials, film adhesives thermal interfaces.
HumiSeal, protective coatings that conform to your requirements.
OxyChem® Electronic Materials OxySIM® 540 series liquid BMI encapsulants OxySIM® 840 series epoxy encapsulants
Parylene Coating Services, Inc. Pin-hole free conformal coating.
Plasma Systems, Inc. Conformal Coatings and Potting.