| Equipment |
Model |
KE750, KE760 |
|
|
| General |
Package styles placed |
SOIC, PLCC, TSOP, QFP, BGA, TAB, CSP,
Flip chip, Direct chip attach, Surface mount connectors, microBGA,
0201 |
|
|
Board size
capability |
Maximum size |
510 mm x 460 mm |
|
|
| Minimum size |
30 mm x 50 mm |
|
|
| Maximum thickness |
6 mm |
|
|
| Minimum thickness |
0.4 mm |
|
|
| Maximum warpage |
±2 mm |
|
|
| Comp. handling |
Centering type |
Optical, laser, programmable force |
|
|
Programmable
placement force |
Yes |
|
|
| Feeder info. |
Part feeder types |
Tape/Tube/Tray/Bulk/Direct wafer feeders |
|
|
| Max. number 8mm |
80 |
|
|
| Max. number 12 mm |
N/A |
|
|
| Max. number 16 mm |
N/A |
|
|
| Max. number 24 mm |
N/A |
|
|
| Max. number 32 mm |
N/A |
|
|
| Max. number 56 mm |
N/A |
|
|
| Other sizes |
N/A |
|
|
| Max. number of tubes |
N/A |
|
|
| Tray changer |
Yes |
|
|
| Speed |
Rated speed/cycle time:
0402-1206 chips(w/adhes.) |
N/A |
|
|
Rated speed/cycle time:
0402-1206 chips(w/o adhes.) |
12,000 cph |
|
|
Rated speed/cycle time:
SOICs and PLCCs |
9,000 cph |
|
|
Rated speed/cycle time:
256 I/O BGA |
1.1 to 1.8 sec. |
|
|
Rated speed/cycle time:
208 I/O 5-mil fine-pitch QFP |
N/A |
|
|
| Movement during placement |
Head |
|
|
| Placement head |
Type |
Laser centering |
|
|
| Resolution (X, Y) |
0.0005 |
|
|
| Repeatability (X, Y) |
±0.001 in. |
|
|
| Adhesive plcmnt. integrated |
No |
|
|
| Board handling |
Optical alignment |
Yes |
|
|
| Board held by |
Edge clamp |
|
|
| Fiducials supported |
Yes |
|
|
| How many types? |
All |
|
|
| Conveyor: optional standard |
Std. |
|
|
| Board movement |
R to L, L to R |
|
|
| Program |
CAD download |
Yes |
|
|
| Off-line programming? |
Yes |
|
|
|
