| Equipment |
Model |
Flex4 |
|
|
| General |
Package styles placed |
SOIC, PLCC, TSOP, QFP, BGA, Flip chip,
Odd-form, Surface mount connectors |
|
|
Board size
capability |
Maximum size |
400 mm x 450 mm |
|
|
| Minimum size |
35 mm x 40 mm |
|
|
| Maximum thickness |
4 mm |
|
|
| Minimum thickness |
0.5 mm |
|
|
| Maximum warpage |
2 mm |
|
|
| Comp. handling |
Centering type |
Optical, high speed 256 level, gray
scale |
|
|
Programmable
placement force |
No |
|
|
| Feeder info. |
Part feeder types |
Tape/Tube/Tray/Bulk/custom |
|
|
| Max. number 8mm |
160 |
|
|
| Max. number 12 mm |
80 |
|
|
| Max. number 16 mm |
40 |
|
|
| Max. number 24 mm |
40 |
|
|
| Max. number 32 mm |
26 |
|
|
| Max. number 56 mm |
20 |
|
|
| Other sizes |
44 mm-20 |
|
|
| Max. number of tubes |
80 SOIC 32 mm(30), 50 mm (20), 120 mm
(20) |
|
|
| Tray changer |
Yes |
|
|
| Speed |
Rated speed/cycle time:
0402-1206 chips(w/adhes.) |
N/A |
|
|
Rated speed/cycle time:
0402-1206 chips(w/o adhes.) |
6,000 cph |
|
|
Rated speed/cycle time:
SOICs and PLCCs |
6,000 cph |
|
|
Rated speed/cycle time:
256 I/O BGA |
5,700 cph |
|
|
Rated speed/cycle time:
208 I/O 5-mil fine-pitch QFP |
5,700 cph |
|
|
| Movement during placement |
Head |
|
|
| Placement head |
Type |
AC servo/ball screw/four head/precision
drive |
|
|
| Resolution (X, Y) |
0.01 mm |
|
|
| Repeatability (X, Y) |
0.02 mm |
|
|
| Adhesive plcmnt. integrated |
N/A |
|
|
| Board handling |
Optical alignment |
Yes |
|
|
| Board held by |
Edge clamp, tooling pins |
|
|
| Fiducials supported |
Yes |
|
|
| How many types? |
All |
|
|
| Conveyor: optional standard |
Std. |
|
|
| Board movement |
R to L, L to R |
|
|
| Program |
CAD download |
Yes |
|
|
| Off-line programming? |
Yes |
|
|
|
