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2000 Pick-and-Place Equipment Survey : Manncorp

Equipment Model CP-20 S Class    
General Package styles placed SOIC, PLCC, TSOP, QFP, BGA, TAB, CSP, microBGA, Surface mount connectors    
Board size
capability
Maximum size 460 mm x 400 mm    
Minimum size 50 mm x 50 mm    
Maximum thickness 4 mm    
Minimum thickness 0.5 mm    
Maximum warpage N/A    
Comp. handling Centering type Optical, laser, combination, programmable force    
Programmable
placement force
Yes    
Feeder info. Part feeder types Tape/Tube/Tray/Bulk    
Max. number 8mm 104    
Max. number 12 mm 34    
Max. number 16 mm 34    
Max. number 24 mm 26    
Max. number 32 mm 20    
Max. number 56 mm 17    
Other sizes 44 mm    
Max. number of tubes 4 lane (13)    
Tray changer Yes    
Speed Rated speed/cycle time:
0402-1206 chips(w/adhes.)
N/A    
Rated speed/cycle time:
0402-1206 chips(w/o adhes.)
9,700 cph    
Rated speed/cycle time:
SOICs and PLCCs
9,700 cph    
Rated speed/cycle time:
256 I/O BGA
4,200 cph    
Rated speed/cycle time:
208 I/O 5-mil fine-pitch QFP
4,200 cph    
Movement during placement Head    
Placement head Type Digital head    
Resolution (X, Y) 0.01 mm    
Repeatability (X, Y) 0.05 mm    
Adhesive plcmnt. integrated No    
Board handling Optical alignment Yes    
Board held by Edge clamp, tooling pins    
Fiducials supported Yes    
How many types? All    
Conveyor: optional standard Std.    
Board movement R to L    
Program CAD download Yes    
Off-line programming? Yes    

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