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2000 Pick-and-Place Equipment Survey : MultiTroniks (3)

Equipment Model SHM-HS DHM-HS  
General Package styles placed

SOIC, PLCC, TSOP, QFP, BGA, Flip chip, Odd-forms, Direct chip attach, CSP, Surface mount connectors

SOIC, PLCC, TSOP, QFP, BGA, Flip chip, Odd-forms, Direct chip attach, CSP, Surface mount connectors

Board size
capability
Maximum size 460 mm x 410 mm 460 mm x 410 mm  
Minimum size 50 mm x 50 mm 50 mm x 50 mm  
Maximum thickness 5 mm 5 mm  
Minimum thickness 0.5 mm 0.5 mm  
Maximum warpage 0.4 mm per 100 mm 0.4 mm per 100 mm  
Comp. handling Centering type Optical, programmable force Optical, programmable force  
Programmable
placement force
Yes Yes  
Feeder info. Part feeder types All Intelligent, Tape/Tube/ Tray/Cart system/Belt All Intelligent, Tape/Tube/ Tray/Cart system  
Max. number 8mm 144 144  
Max. number 12 mm 72 72  
Max. number 16 mm 72 72  
Max. number 24 mm 48 48  
Max. number 32 mm 48 48  
Max. number 56 mm 24 24  
Other sizes 44 mm, 72 mm 44 mm, 72 mm  
Max. number of tubes SOIC (210), SOL (130), PLCC84 (40) SOIC (210), SOL (130), PLCC84 (40)  
Tray changer Yes Yes  
Speed Rated speed/cycle time:
0402-1206 chips(w/adhes.)
4,800 cph 9,600 cph  
Rated speed/cycle time:
0402-1206 chips(w/o adhes.)
6,000 cph 12,000 cph  
Rated speed/cycle time:
SOICs and PLCCs
4,200 cph 9,500 cph  
Rated speed/cycle time:
256 I/O BGA
2,500 cph 6,500 cph  
Rated speed/cycle time:
208 I/O 5-mil fine-pitch QFP
2,000 cph 6,500 cph  
Movement during placement Head Head  
Placement head Type 3G high speed linear drive (5 nozzle) Dual gantry 3G high speed linear drive (10 nozzles)  
Resolution (X, Y)

0.005 mm

0.005 mm

 

Repeatability (X, Y) 0.03 mm 0.03 mm  
Adhesive plcmnt. integrated Opt. Opt.  
Board handling Optical alignment Yes Yes  
Board held by Edge clamp Edge clamp  
Fiducials supported Yes Yes  
How many types? All All  
Conveyor: optional standard Std. Std.  
Board movement R to L opt., L to R std. R to L opt., L to R std.  
Program CAD download Yes Yes  
Off-line programming? Yes Yes  

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