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2000 Pick-and-Place Equipment Survey : PlaceMax

Equipment Model Model 5000    
General Package styles placed SOIC, PLCC, TSOP, QFP, BGA, TAB, Flip chip, Surface mount connetor, Odd form    
Board size
capability
Maximum size 900 mm x 1,200 mm    
Minimum size 12 mm x 12 mm    
Maximum thickness 12.0 mm    
Minimum thickness 0.2 mm    
Maximum warpage 13 mm over 50 mm area    
Comp. handling Centering type Optical, laser, mechnical, combination, programmable force    
Programmable
placement force
Yes    
Feeder info. Part feeder types Tape/Tube/Tray/Bulk / Custom    
Max. number 8mm 144    
Max. number 12 mm 72    
Max. number 16 mm 72    
Max. number 24 mm 45    
Max. number 32 mm 36    
Max. number 56 mm 18    
Other sizes Custome    
Max. number of tubes SOIC narrow (192), SOIC wide (144), PLCC 20 (105), PLCC 84 (72)    
Tray changer Yes    
Speed Rated speed/cycle time:
0402-1206 chips(w/adhes.)
4,500 cph    
Rated speed/cycle time:
0402-1206 chips(w/o adhes.)
6,500 cph    
Rated speed/cycle time:
SOICs and PLCCs
5,000 cph    
Rated speed/cycle time:
256 I/O BGA
1,500 cph    
Rated speed/cycle time:
208 I/O 5-mil fine-pitch QFP
1,400 cph    
Movement during placement Head    
Placement head Type Dual spindle, AC servo / ball screw    
Resolution (X, Y)

0.01 mm

   
Repeatability (X, Y) ±0.02 mm    
Adhesive plcmnt. integrated Yes    
Board handling Optical alignment Yes    
Board held by Edge clamp, tooling pins    
Fiducials supported Yes    
How many types? All    
Conveyor: optional standard Opt.    
Board movement R to L, L to R    
Program CAD download Yes    
Off-line programming? Yes    

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