| Equipment |
Model |
MyData TPII Hydra |
|
|
| General |
Package styles placed |
SOIC, PLCC, TSOP, QFP, BGA, Flip chip,
Odd-form, TAB, Surface Mount connectors, CSP |
|
|
Board size
capability |
Maximum size |
609 mm x 914 mm |
|
|
| Minimum size |
19 mm x 19 mm |
|
|
| Maximum thickness |
6.35 mm |
|
|
| Minimum thickness |
1 mm |
|
|
| Maximum warpage |
20 mm |
|
|
| Comp. handling |
Centering type |
Optical, mechanical , combination, Programmable
force |
|
|
Programmable
placement force |
Yes |
|
|
| Feeder info. |
Part feeder types |
Tape/Tube/Tray |
|
|
| Max. number 8mm |
160 |
|
|
| Max. number 12 mm |
N/A |
|
|
| Max. number 16 mm |
N/A |
|
|
| Max. number 24 mm |
N/A |
|
|
| Max. number 32 mm |
N/A |
|
|
| Max. number 56 mm |
N/A |
|
|
| Other sizes |
N/A |
|
|
| Max. number of tubes |
SOIC (150) |
|
|
| Tray changer |
Yes |
|
|
| Speed |
Rated speed/cycle time:
0402-1206 chips(w/adhes.) |
14,400 cph |
|
|
Rated speed/cycle time:
0402-1206 chips(w/o adhes.) |
14,400 cph |
|
|
Rated speed/cycle time:
SOICs and PLCCs |
5,100 cph |
|
|
Rated speed/cycle time:
256 I/O BGA |
5,000 cph |
|
|
Rated speed/cycle time:
208 I/O 5-mil fine-pitch QFP |
5,000 cph |
|
|
| Movement during placement |
Split axis design |
|
|
| Placement head |
Type |
Controlled centering |
|
|
| Resolution (X, Y) |
0.002 mm, 0.005 mm
|
|
|
| Repeatability (X, Y) |
0.0267 mm |
|
|
| Adhesive plcmnt. integrated |
Opt. |
|
|
| Board handling |
Optical alignment |
Yes |
|
|
| Board held by |
Edge clamp |
|
|
| Fiducials supported |
Yes |
|
|
| How many types? |
All |
|
|
| Conveyor: optional standard |
Opt. |
|
|
| Board movement |
R to L, L to R |
|
|
| Program |
CAD download |
Yes |
|
|
| Off-line programming? |
Yes |
|
|
|
