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Universal 4790 High Speed Placement System

4790HSP

Technical Specifications
Placement cycle rate 0.14 ~ 1.50 sec/comp. (25,000 ~ 2,400 comp/hour)
Max. placement accuracy Open loop(chips, IC): ±0.15mm / Closed loop (IC): ±0.10mm
Placement orientation Open loop: 0 ~ 359° in 0.1° increments
Close loop: 0,90,180,270° in 90° increments
Component placement pressure Adjustable through the programmable Z-height setting and 200 gram nominal
Placement performance 100 ppm (99.99%)
Intrinsic availability 95%
Component sizes Min: 0402, Max: 20x20mm, thickness: 0.35~5.7mm, lead pitch: 0.5~1.27mm
Feeder input 8 x 2-8mm, 12 x 4-12mm, 16 x 4-16mm, 24 x 8-24mm, 32 x 12-24mm
Board size Min: 50x50mm, Max: 510x460mm, thickness: 0.8~5.0mm
Board registration Edge clamp/tooling pin/vision(PEC)
Board transfer direction Standard: left to right, Optional: Right to left.
Transfer height 962.2 ±5mm
Transfer time 5 seconds without PEC, 7 seconds with PEC
Machine dimensions 6000 x 2135 x 2075 mm
Weight 4968 kg
Electrical supply 200 VAC(+20/-10VAC), 3-phase, 50/60Hz, 30A (6KVA)
Air supply 4~7 kgf/cm2, 25 litres per minute at 4 kgf/cm2

The specification and appearance may be changed without notice.


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