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SMT in Line
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Technical Specifications
| Placement cycle rate | 0.14 ~ 1.50 sec/comp. (25,000 ~ 2,400 comp/hour) |
| Max. placement accuracy | Open loop(chips, IC): ±0.15mm / Closed loop (IC): ±0.10mm |
| Placement orientation | Open loop: 0 ~ 359° in 0.1° increments Close loop: 0,90,180,270° in 90° increments |
| Component placement pressure | Adjustable through the programmable Z-height setting and 200 gram nominal |
| Placement performance | 100 ppm (99.99%) |
| Intrinsic availability | 95% |
| Component sizes | Min: 0402, Max: 20x20mm, thickness: 0.35~5.7mm, lead pitch: 0.5~1.27mm |
| Feeder input | 8 x 2-8mm, 12 x 4-12mm, 16 x 4-16mm, 24 x 8-24mm, 32 x 12-24mm |
| Board size | Min: 50x50mm, Max: 510x460mm, thickness: 0.8~5.0mm |
| Board registration | Edge clamp/tooling pin/vision(PEC) |
| Board transfer direction | Standard: left to right, Optional: Right to left. |
| Transfer height | 962.2 ±5mm |
| Transfer time | 5 seconds without PEC, 7 seconds with PEC |
| Machine dimensions | 6000 x 2135 x 2075 mm |
| Weight | 4968 kg |
| Electrical supply | 200 VAC(+20/-10VAC), 3-phase, 50/60Hz, 30A (6KVA) |
| Air supply | 4~7 kgf/cm2, 25 litres per minute at 4 kgf/cm2 |
The specification and appearance may be changed without notice.