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ECM-99LV: Flip Chip/CSP Placer with Vision
Low cost vision placer for flip chips, CSPs and other
specialty components! This advanced machine combines powerful technologies, such
as CyberOptics® non-contact alignment on single or dual digital heads,
256-level gray scale vision, and powerful, reliable servo-motors to achieve
accuracy within ±0.05mm.
includes: lead-screw-driven placement head with CyberOptics® laser
centering, 256-level gray-scale vision with front-and-back lighting, teaching
camera, one 24-lane feeder base, PC, monitor, and software.
Features
CyberOptics® noncontact laser centering
Reliable servo-motors for accuracy within ±0.05mm
Lead-screw-driven single or dual (optional) heads
Handles all of today's technologies from capacitors down to 0201 to
advanced chip scale and flip chip technologies
Achieves 4,000pph with one head, 5,700pph with optional second head
In/out sliding shuttle for easy loading/unloading of boards to 14"
x 14"
Teaching camera included
256-level gray scale vision for fine pitch parts to 15 mil
Intelligent front-and-back lighting
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