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Mirae SMD Placement System - A wide range of system configurations

MPS-1010MPS-1010

High Speed Dual Gantry
MPS-1010
High Speed Single Gantry
MPS-1020
Mid Speed Single Gantry
MPS-1030
Tact Time Chip
0.096sec/chip(optional)
28000cph(*IPC-9850)
0.174sec/chip(optional)
15000cph(*IPC-9850)
0.196sec/chip(optional)
11000cph(*IPC-9850)
QFP
0.987 sec/QFP
0.987 sec/QFP
0.987 sec/QFP
Placing accuracy chip
± 0.1 mm
± 0.1 mm
± 0.1 mm
QFP
± 0.08 mm
± 0.08 mm
± 0.08 mm
Board size
30x50 ~ 410x360mm
t: 0.4~5.0mm
30x50 ~ 410x360mm
t: 0.4~5.0mm
30x50 ~ 410x360mm
t: 0.4~5.0mm
Components
1005 ~ 18x18
1005 ~ 18x18
1005 ~ 18x18
Number of components (8mm feeder)
90
90
90
Resolution
XY Gantry: 0.001mm
Head R: 0.044deg
Head Z: 0.0035mm
XY Gantry: 0.001mm
Head R:0.044deg
Head Z: 0.0035mm
XY Gantry: 0.002mm
Head R:0.044deg
Head Z: 0.0035mm
Transport Height
37.5±0.5 inch **SMEMA
910+30,-10 mm(option)
37.5±0.5 0.5inch **SMEMA
910+30,-10 mm(option)
37.5±0.5 0.5inch **SMEMA
910+30,-10 mm(option)
Transport direction
Left to Right(standard)
Right to Left(option)
Left to Right(standard)
Right to Left(option)
Left to Right(standard)
Right to Left(option)
Power requirement
3 phase
200V/208V/220V/230V/240V
380V/400V/415V(option)
50/60Hz
3 phase
200V/208V/220V/230V/240V
380V/400V/415V(option)
50/60Hz
3 phase
200V/208V/220V/230V/240V
380V/400V/415V(option)
50/60Hz
Power consumption
7.5KVA
6.0KVA
3.0KVA
Air consumption
700 Nl/min
500 Nl/min
300 Nl/min
Weight (approx.)
2000kg
1800kg
1500kg
***Dimension(WxDxH)
1870x2540x1765mm
1870x2540x1765mm
1870x2035x1680mm
*IPC: Institute for Interconnecting & Packaging Electronic Circuits
**SMEMA: Surface Mount Equipment Manufacturers Association
***Excluding the height of Tower Lamp 485mm

MPS-1030MPS-1030

Dual+Precision Head
MPS-1010P
Single Precision Head
MPS-1020P
Single Precision Head
MPS-1030P
Tact Time Chip
0.11sec/chip(optional)
24000cph(*IPC-9850)
0.228sec/chip(optional)
12000cph(*IPC-9850)
0.272sec/chip(optional)
8000cph(*IPC-9850)
QFP
0.987 sec/QFP
0.987 sec/QFP
0.987 sec/QFP
Placing accuracy chip
± 0.1 mm
± 0.1 mm
± 0.1 mm
QFP
± 0.04 mm
± 0.04 mm
± 0.04 mm
Board size
30x50 ~ 410x360mm
t: 0.4~5.0mm
30x50 ~ 410x360mm
t: 0.4~5.0mm
30x50 ~ 410x360mm
t: 0.4~5.0mm
Components
1005 ~ 50x50 0.3mm pitch
QFP,BGA,CSP,connector
1005 ~ 50x50 0.3mm pitch
QFP,BGA,CSP,connector
1005 ~ 50x50 0.3mm pitch
QFP,BGA,CSP,connector
Number of components (8mm feeder)
90
90
90
Resolution
XY Gantry: 0.001mm
Head R: 0.044deg
Head Z: 0.0035mm
Precision R: 0.0055deg
Precision Z: 0.0012mm
XY Gantry: 0.001mm
Head R:0.044deg
Head Z: 0.0035mm
Precision R: 0.0055deg
Precision Z: 0.0012mm
XY Gantry: 0.002mm
Head R:0.044deg
Head Z: 0.0035mm
Precision R: 0.0055deg
Precision Z: 0.0012mm
Transport Height
37.5±0.5 inch **SMEMA
910+30,-10 mm(option)
37.5±0.5 0.5inch **SMEMA
910+30,-10 mm(option)
37.5±0.5 0.5inch **SMEMA
910+30,-10 mm(option)
Transport direction
Left to Right(standard)
Right to Left(option)
Left to Right(standard)
Right to Left(option)
Left to Right(standard)
Right to Left(option)
Power requirement
3 phase
200V/208V/220V/230V/240V
380V/400V/415V(option)
50/60Hz
3 phase
200V/208V/220V/230V/240V
380V/400V/415V(option)
50/60Hz
3 phase
200V/208V/220V/230V/240V
380V/400V/415V(option)
50/60Hz
Power consumption
7.5KVA
6.0KVA
3.0KVA
Air consumption
700 Nl/min
500 Nl/min
300 Nl/min
Weight (approx.)
2000kg
1800kg
1500kg
***Dimension(WxDxH)
1870x2540x1765mm
1870x2540x1765mm
1870x2035x1680mm
*IPC: Institute for Interconnecting & Packaging Electronic Circuits
**SMEMA: Surface Mount Equipment Manufacturers Association
***Excluding the height of Tower Lamp 485mm

Mirae IC Placement System

MPS-1050MMPS-1050

Memory & IC mounter MPS-1050M
Tact Time Chip
0.36 sec/chip
IC
0.487 sec/QFP
Placing accuracy chip
± 0.1 mm
IC
± 0.1 mm
Board size
50x50 ~ 230x350mm
t: 0.4~5.0mm
Components
1005 ~ 23x23mm
Number of components (8mm feeder)
18 stations x 2 banks
Resolution
XY Gantry: 0.002mm
Head R: 0.044deg
Head Z: 0.0023mm
Transport Height
37.5±0.5 inch **SMEMA
900±20 mm(option)
Transport direction
Left to Right(standard)
Right to Left(option)
Power requirement
3 phase
200V/208V/220V/230V/240V
380V/400V/415V(option)
50/60Hz
Power consumption
2.5KVA
Air consumption
300 Nl/min
Weight (approx.)
1500kg
***Dimension(WxDxH)
1690x2005x1785mm
*IPC: Institute for Interconnecting & Packaging Electronic Circuits
**SMEMA: Surface Mount Equipment Manufacturers Association
***Excluding the height of Tower Lamp 485mm

TFU & Shuttle

MPS-20TFU IITFU & ShuttleMPS-40SU

ITEM MPS-20TFU II MPS-40SU
Tray size (WxDxH) 325x215x7.6mm 315x260x7.6mm
Application parts QFP,BGA,SOP,CSP, etc. 10x10 ~ 50x50mm
Tray stacking capability 20 Stacks 40 Stacks
Power requirement Supplied from the main unit Supplied from the main unit
Power consumption 0.6 KVA 0.6 KVA
Air Supplied from the main unit Supplied from the main unit
Weight(approx.) 50 Kg 150 Kg
Dimension(WxDxH) 500x870x750mm 800x1,200x1,540mm

Interlligent component feederFeeder

HeadHigh Speed Module Head

High Performance VisionVision

TrayEmbossed tray supply unit(on the fly)

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