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High-speed chip shooter
KE-2010

11,000 cph: chip(Effective tact)

1 multi nozzle laser head (4 nozzles)

From 0603 (0201) chip to 26.5 x 11 mm chip or 20 mm square chip
Twin-head high-speed chip shooter
KE-2030

20,000 cph: chip(Effective tact)

2 multi nozzle laser head (8 nozzles)

From 0603 (0201) chip to 26.5 x 11 mm chip or 20 mm square chip

High-speed flexible mounter
KE-2020

11,000 cph: chip(Effective tact)

1,800 cph: IC(Effective tact)

1 multi nozzle laser head (4 nozzles) and 1 high-resolution head(1 nozzle)

From 0603 (0201) chip to 50 mm square chip

Vision centering system (featuring reflective/penetrative type lighting, ball recognition and division recognition)
High-speed flexible IC mounter
KE-2040

6,400 cph: chip(Effective tact)

2,500 cph: IC(Effective tact)

2 high-resolution head(2 nozzle)

From 1005 chip to 50 mm square chip

Vision centering system (featuring reflective/penetrative type lighting, ball recognition and division recognition)

KE-2000 Series Specifications

Model Name		Twin-head high-speed chip shooter	High-speed chip shooter	High-speed flexible mounter	High-speed flexible IC mounter
		KE-2030	KE-2010	KE-2030	KE-2040
Applicable board size	Min	50x30mm, thickness: 0.4mm *50x50mm, with optional auto-width conveyor
	Max.	510x460mm, thickness: 4.0mm
Applicable component height		6 mm	6 mm optional 20mm	12 mm optional 20mm	25 mm
Component placement speed(Effective tact¹)	Chip	20,000 cph	11,000 cph	11,000 cph	6,400 cph
	IC	-	-	1,800 cph	2,500 cph
Max. unique components		60 per side (120 total) (8-mm tape)	80 (8-mm tape) (Max. 120 types if a matrix tray changer is used)
Feeder types available		Tape (8, 12, 16, 24, 32, 44, 56, 72mm, 32mm adhesive) Stick/bulk/tray(tray not available for KE-2030)
Weight(approx.)		1900 kg	1400 kg	1400 kg	1400 kg
Power supply		3-phase 200, 220, 240, or 380V AC
Apparent power		5 kVA	3 kVA
Air pressure		0.49 ± 0.05 Mpa
Air consumption(standard condition)		400 L/min	200 L/min	250 L/min	150 L/min
1 = The chip placement speed indicates an estimate obtained when the machine places 400 1608-chips all over an medium size of board whose dimensions are 330 x 250 mm. TheIC placement speed indicates an estimate obtained when the machine places 36 QFP components(100 pins or more) or BGA components (256 balls or more) all over an medium size of board whose dimensions are 330 x 250 mm.

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High-speed chip shooter KE-2010 11,000 cph: chip(Effective tact) 1 multi nozzle laser head (4 nozzles) From 0603 (0201) chip to 26.5 x 11 mm chip or 20 mm square chip	Twin-head high-speed chip shooter KE-2030 20,000 cph: chip(Effective tact) 2 multi nozzle laser head (8 nozzles) From 0603 (0201) chip to 26.5 x 11 mm chip or 20 mm square chip
High-speed flexible mounter KE-2020 11,000 cph: chip(Effective tact) 1,800 cph: IC(Effective tact) 1 multi nozzle laser head (4 nozzles) and 1 high-resolution head(1 nozzle) From 0603 (0201) chip to 50 mm square chip Vision centering system (featuring reflective/penetrative type lighting, ball recognition and division recognition)	High-speed flexible IC mounter KE-2040 6,400 cph: chip(Effective tact) 2,500 cph: IC(Effective tact) 2 high-resolution head(2 nozzle) From 1005 chip to 50 mm square chip Vision centering system (featuring reflective/penetrative type lighting, ball recognition and division recognition)

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