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High SPEED and high FLEXIBILITY
The MP1260-S is capable of placment rates up to 15,000 CPH and is achieved through a parallel pick of components presented on tape and tube. Two placement modules with five placement heads each pick up to five components simultaneously. In addition, the system is equipped with a FAST-FLASH vision system for component alignment.
Placement rates up to 15,000 CPH
Max. 108 feeder locations (based on 8mm feeders)
Two placement modules, ten vacuum placement heads
Simultaneous pick of five components
Fast-Flash and parallel processing for component alignment
Vision on-the-fly for chips and SOICs
Bar-coded feeders and components for continued operation and real-time inventory
Circuit boards approx. 15 x 16 inch
Components from 0201 to 55 x 55 mm; fine pitch capable
RELATED PAGES
MP1260 series
MP1260-L
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