SMT in Line
www.smtinline.com

CATEGORY

RESULTS

PROCEDURES/REMARKS

CHEMICAL PROPERTIES

Activity Level

ROL-0 = J-STD Classification

IPC J-STD-004

Halide Content

Halide free (by titration). Passes Ag Chromate Test

IPC J-STD-004

Bono Testing

Pass (Sn 63/Pb 37)

Bonn Testing Standard

ELECTRICAL PROPERTIES

SIR (IPC 7 days @ 85° C/85% RH)

4.8 x 10⁹ ohms

Pass, IPC J-STD-004 {Pass = 1 x 10⁸ ohm min}

SIR (Bellcore 96 hours @ 35° C/85% RH)

1.5 x 10¹² ohms

Pass, Bellcore GR78-CORE {Pass = 1 x 10¹¹ ohm min}

Electromigration (Bellcore 500 hours @ 65° C/85° RH)

initial 1.7 x 10¹⁰ ohms, final 1.2 x 10¹⁰ ohms

Pass, Bellcore GR78-CORE 62Sn/36Pb/2Ag {Pass= final > initial/10}

PHYSICAL PROPERTIES

Using 90% Metal, Type #3 Powder

Color & Specific fffffGravity

Clear, Colorless Flux Residue; 4.6 g/cc paste

63Sn/37Pb alloy

Tack Force vs. Humidity (4 hours)

1.7 g/mm² at 25%RH
2.1 g/mm² at 50%RH
1.8 g/mm² at 75 % RH

IPC J-STD-005

Viscosity

90% metal load designated M13 is suitable for all typical stencil printing applications.

Malcom Spiral Viscometer; J-STD-005

Solderball

Pass < 10 count (62Sn/36Pb/2Ag and 63Sn/37Pb alloy)

Pass IPC J-STD-005

Class 2, 1 hour Pass (Sn63/Pb37)*

DIN Standard 32 513, 4.4 * Preliminary Results

Stencil Life

> 8 hours

@ 50%RH, 74° F (23^oC)

Slump

Hot Slump max bridge fine pitch aperture = 10 – 15 mil(25 mil is maximum bridge allowed for pass rating)

IPC J-STD-005

.2

DIN Standard 32 513, 5.3

OM-5000 Processing Guidelines

STORAGE-HANDLING

PRINTING

REFLOW (See Figure #1)

CLEANING

· Refrigerate to guarantee stability @35-45° F (3-7° C)

· Shelf life of refrigerated paste is six months. Unopened OM-5000 can be stored at Room Temp (up to 77° F, 25° C) for up to 1 month.

· Required warm-up of paste container to room temperature for approx 4 to 6 hours. Paste must be 74^oF (23^oC) before processing. Verify paste temperature with a thermometer to ensure paste is at 74^oF (23^oC or greater) before setup. Printing can be performed at temperatures up to 85^oF (30^oC).
· Do not remove worked paste from stencil and mix with unused paste in jar. This will alter rheology of unused paste.

STENCIL: Recommend Alpha laser cut stencil @ 0.005 or 0.006 inch thick for 0.016 or 0.020 mil pitch

SQUEEGEE: Recommend metal or 90 durometer

polyurethane.

PRESSURE: 1.0-2.0 pounds per linear inch of squeegee length.

SPEED: 1 to 8 inches (25mm to 200 mm) per second.

PASTE ROLL: 1.5-2.0 cm diameter and make additions when roll reaches 1 cm diameter. Maximum roll size will depend upon blade type.

PRINT PUMP HEAD:
OM-5000 is suitable for use in both MPM RheoPumpÔ and DEK ProFloÔ systems.

ATMOSPHERE: Clean-dry air or nitrogen atmosphere.

PROFILE (Sn 63 alloy):

A straight ramp profile @ 0.8° C to 1.2^oC per second ramp rate is recommended. High density assemblies may require preheating within the profile and may be accomplished as follows:

- Ramp @ 60-120° C/min. to
145-160° C.

- Dwell @ 145-160° C for 0.5-2.0
minutes.

- Ramp @ 1-2° C/sec to 210-
225° C peak temp. Time above
183° C=45-70 secs

- Ramp down to R.T. @ 1.5 to
2° C per second.

·Alpha OM-5000 residue is designed to remain on the board after reflow.

Misprints and soft flux residues remaining after rework may be removed with Bioact™SC-10 & SC-10E solvents and Hydrex™ Aquueous cleananners available from Alpha Metals.