G3 Series Medium-Speed Fine-Pitch Placement Machine with One-Head Triple-Nozzle System Handling a Wide Range of Components and Packages. Features High-speed placement by one head with triple nozzle    Placement speed of 0.8 sec/ piece (chip components) and 1.0 sec/ piece (QFPs) is achieved by gang pickup, quality 2D scan recognition, self-indexing parts feeder, and tray supplier.    Self-indexing parts feeder realizes simultaneous triple-nozzle pickup. Able to handle a wide range of components and packages    The machine can handle anything from microchips (option) to QFPs, BGAs and CSPs and can also handle connectors and odd-shaped components up to 50 mm and 100 mm in length. High-Precision Placement    Has the same recognition system as that of the MPAV2 multifunctional placement machine, which ensures reliable high-precision recognition.    A 3D sensor for laser scanning can also be incorporated to check lead bending of QFPs. Ease of operation    Interactive operation with the LCD monitor, providing a user-friendly man-machine interface.