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FUJI XP-141E/XP-241E
High-speed compact chip shooter/Compact multi-purpose mounter

XP-141E

 XP-141E; compact high-speed chip shooter with advanced one-shot vision syste.

Head fdr

  • Compact size makes this the ideal booster machine for the XP-241E.
  • High speed placement using 12 nozzles mounted on miniature turret.
  • Support the creation and editing of production programs at the machine, and allows the user to "teach" the machine fine adjustments.
  • Supports the supply of up to 100 component types on 8 mm tape, and the use of existing CP-6-series feeders.
  • Support for bulk feeders.
 

XP-241E

 XP-241E; compact multipurpose mounter with advanced one-shot vision system.

Head Tray unit

  • Wide handling range, from 1005s(in. 0402) to parts of up to 150 mm long.
  • 100% bump detection for components such as CSPs and BGAs.
  • Supports the supply up to 40 component types on tape or stick feeders, and up to 20 component types on trays.
  • Mechanical chucks supported
  • Compatible with mechanical feeders used on IP-series, and QP-242E machines.
  • Supports the creation and editing of production programs at the machine, and allows the user to "teach" the machine fine adjustments.

 Feactures
   XP-141E
One-shot vision

Top of its class high speed placement at 0.165 ec./component Twelve nozzles mounted on a miniature turret allows component inspection on-the-fly, whilst the MS algorithm ensures placement accuracy at 0.165 sec./component.

Small footprint
Supplying components from both sides of the machine enables high speed placement whilst providing excellent output to space efficency.
   XP-141E/XP-241E
Calibrate bumps

Direct Motion Mounter (DMM)
Cycle time reduced with adoption of on-the-fly parts inspection, especially beneficial during the handling of 150 mm connectors on the XP-241E.

MS algorithm
The MS algorithm allows for the accurate correction of optical distortion, enabling high accuracy placing through more accurate inspection of both parts and fiducial marks.
   XP-241E
V2 Nozzle

V2 nozzle
Vacuum nozzle attachment system ensures high accuracy and high speed nozzle alignment redundant. In addition, the risk of dropped nozzles is eliminated by the head to above the nozzle station when idle.

Wide range of components
Custom nozzles and mechanical chucks can be used to support the placement of components from 1005s(in.0402) up to components 150 mm long.
Specifications
Model XP-141E XP-241E
PCB dimensions 50 mm(L) x 50 mm(W) ~ 457 mm(L) x 356 mm(W)
Thickness: 0.5 ~ 4.0 mm (including options)
Component capacity Up to 100 types (2 x 50 8mm tape) Up to 40 types (8 mm tape)
Up to 20 types (trays)
Stick feeders also supported.
Placing rate 0.165 sec./shot 0.4 ~ 0.6 sec./component for chips
0.7 ~ 1.5 sec./component for ICs
Fiducial mark reading time Approx. 0.5 sec./mark obtained when reading 1.2 mm dia. mark, excluding travel between marks, and adjustments for mark shape and location errors.
Placing accuracy (fiducial mark reference) ±0.06 mm (3 σ) / ±0.12 mm (6 σ) ±0.06 mm (3 σ) / ±0.12 mm (6 σ) for chips
±0.03 mm (3 σ) / ±0.06 mm (6 σ) for QFPs
Applicable components 0603 to 5x4 mm max. height 3 mm 1005 to 45 mm x 150 mm
Max. height 25.4mm(including options)
Packaging Tape: 8, 12 mm
Reel diameter 180, 330		 Tape: 8, 12, 16, 24, 32, 44, 56, 72, 88
Tray: <160 x 330mm, <335 x 330 mm
Stick: 7mm<28 mm, 25mm<40mm
Power 3-phase, 200 ~ 480 VAC, 4KVA
Air supply 0.5MPa (5kgf/cm2), 80 Nl/min 0.5MPa (5kgf/cm2), 200 Nl/min
Machine dimensions L1500 x W1400 x H1409mm L1500 x W1942 x H1480mm
Weight Approx. 1800 kg Approx. 2000 kg
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