Generic Standard on Printed Board Design

IPC-2221 and IPC-2222 replace the IPC-D-275. Some substantial additions to the IPC-D-275 include thermal managements, guidelines for V-groove scoring, and expanded laminates section, updated dimensioning requirements and a formula for determining foil web size.

Establishes the generic requirements for the diesign of organic printed boards and other forms of component mounting or interconnecting structures. The organic materials may be homogeneous, rein-forced, or used in combibation with inorganic materials. The interconnections may be single, double or multilayered. 97 pages. Released March 1998.

Sectional Standard on Rigid PWB Design (Replaces IPC-D-275)

Establishes the specific requirements for the design of rigid organic printed boards and other forms of component mounting and interconnecting structures. The organic materials may be homogeneous, rein-forced or used in combination with inorganic materials. The interconnections may be single, double or multilayered. 24 pages. Released March 1998.

Sectional Design Standard for Flexible Printed Boards (With IPC-2221, Supersedes IPC-D-249)

Provides the user with updated materials considerations, new sections on board configurations, equations on minimum bend radius, differential lengths and new technical illustrations. For use with IPC-2221. 40 pages. Released November 1998.

Sectional Standard for Design of PWBs for PC Cards (With IPC-2221, Supersedes IPC-D-249)

This standard establishes the requirements for the design of printed boards for PC card form factors. The organic materials may be homogeneous, rein-forced, or used in combination with inorganic materials. The interconnections may be single, double, or multilayered. 15 pages. Released January 1998.

Sectional Design Standard for Organic Multi-chip Modules (MCM-L) and MCM-L Assemblies

This standard establishes the requirements and other considerations (thermal, electrical, electromechanical and mechanical) for the design of organic mounting structure used to interconnect chip components, which in combination form the completed functional Single Chip Module (SCM-L), MCM or MCM-L assemblies. 44 pages. Released May 1998.

Technology Reference for Design Manual

As a designer considering physical design prinples, customer reliability requirements and surface mount and high speed logic design, this new manual set provides an excellent compilation of standards essential to your library. Sharp focus is brought to bear on aspects of printed board technology such as high density interconnects, flexible printed board design, controlled impedance, usage of phototooling to improve artwork quality, and Design for Reliability (DfR) procedures. All standards are included within a single three-ring binder for easy reference. Save 50% over individual document prices!

Printed Board Dimensions and Tolerances

This standard covers dimensioning and tolerancing requirements for rigid and flexible, single double and multilayered printed boards based on industry capabilities. 25 pages. Released January 1984.

Design Guide Manual

Contains industry approved guidelines for layout, design, and packaging of electronic inter-connections. Provides references to pertinent specifications: commercial, military, and federal. Includes hundreds of graphs, charts details and photographs.

The Design Guide contains the latest information on materials, design and fabrication of rigid single- and double-sided boards, multilayers, flexible printed wiring; printed wiring assemblies, and others.