Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

Covers the assessments of the solderability of electronic component leads, terminations, solid wire, stranded wire, lugs and tabs. Prescribes test methods, defect defintions, acceptance critiria and illstrations for suppliers and users. Co-produced with EIA. 44 pages. Released October 1998.

Solderability Evaluation of Thick and Thin Fused Coatings

The report identifies and evaluates the effects of thick and thin fused coatings on PWBs. 29 pages. Released March 1979.

Solderability Evaluation of Printed Boards with Protective Coatings Over Long Term Storage

This document provides conclusions and recommendation for the effectiveness of different protective coatings and methods of coating application, PWB solderability after various time periods in typical storage conditions and correlation of time and storage conditions to thickness and characteristics of these coatings. 63 pages. Released October 1987.

Round Robin Test Report on Steam Ager Temperature Control Stability

Provides test data from seven companies using 13 different models of steam agers. The intent of the program was to evaluate the variability of steam aging equipment and to develop a test procedure to quantify this variety so that it may be controlled. The report concludes that the test procedure developed was effective in quantifying steam ager were capable of maintaining a temperature tolerance limit of ±3°C.The report recommends that this limit be made a requirement in dindustry specifications. 20 pages. Released 1993.

The Effect of Steam Aging time and Temperature on Solderability Test Results

This test report is a result of a joint effort of the EIA and IPC. The program was established to resolve as industry impasse regarding steam age time and temperature prior to solderability testing of component leads.

The objective of the effort was to determine the effect of changes in steam age time and temperature and make recommendations for the appropriate conditions for industry specifications and look at the relationship between steam aging conditions and actual production soldering performance. IPC-TR-465-2 concludes that 93°C for 8 hours is optimal condition for industry specifications for both component leads and printed boards. Also, visual tests and production use test trends track well with the wetting balance data collected. 51 pages. Released 1993.

Solderability Tests for Printed Boards

Contains industry-recommentded test methods, defect definitions and illustrations for suppliers and users to assess the solderability of printed board surface conductors, lands and plated through-holes. Test methods covered include edge dip, rotary dip, solder float, wave solder and wetting balance. Co-produced with EIA. 15 pages. Released April 1992.

Accelerated Aging for Solderability Evaluations and Addendum

The report was developed to meet the growing need for a standard method of evaluating the solderability retention capability of printed boards during inventory storage. 32 pages. Revised April 1984. Addendum released December 1987 (7 pages).

PWB Surface Finishes

Seven PWB fabrication experts present their findings on surface mount assembly in this Surface Mount Council White Paper. Topics covered range from surface finish technology drivers and fine pitch packaging for components to direct chip attach and solder paste applications. 46 pages. Editor: Foster Gray, PC Interconnects. Released by the Surface Mount Council April 1997.

Evaluation of Steam Aging On Alternative Finishes, Phase IIA

Details the results of a two-year study to determine the effect of steam aging exposure on components. A variety of solderable finishing were used. Among the conclusions:

1: Steam age conditioning had a measurable effect on all the components tested. The tests clearly identified parts with undesirable surface anomalies. 2: Steam age conditioning on PWB solder float tests had a marginal effect on as-received samples, but added on average 4% dewet area to degraded samples. 3: For both the component and printed wiring board measurements, test location had a large effect

A small production simulation using precondition and as-received samples in which a total of 2,000 joints were tested, showed no defects. Based on this sample the defect rate for this simulation would probably be 350 ppm or less. 15 pages. Released July 1996.

Technical Report: Wetting Balance Standard Weight Comparison Test

The IPC Wetting Balance Task Group developed this test report. The program was established to study the procision of weight measurements taken on the wetting balance and to correlated weight measurements among test participants.

This Technical Report discusses the results of the Task Group efforts to date on studying wetting balance weight measurement precision to establish correlation among all the test users and equipment manufacturers. 16 pages. Released April 1995.