Generic Performance Specification for Printed Boards

This specification establishes the general requirements and responsibilities for suppliers and users of printed boards. Describes quality and reliability assurance requirements that must be met. For use with IPC-6012 through IPC-6018. 10 pages. Released July 1996.

Qualification and Performance Specification for Rigid Printed Boards
(With IPC-6011, Supersedes IPC-RB-276)

This specification covers qualification and performance of rigid printed boards. The printed board may be single-sided, double-sided, with or without plated through-holes, multilayer with or without buried/blind vias and metal core boards. Covers finishes, plating, traces, holes/vias, electrical, mechanical and environmental requirements. For use with IPC-6011. 27 pages. Released July 1996.

Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures

This specification establishes the specific requirements for organic mounting structures used to interconnect chip components, which in combination form the completed functional organic single-chip module (SCM-L) or organic multichip module (MCM-L) assembly and the quality and reliability assurance requirements that must be met for their acquisition. For use with IPC-6011. 17 pages. Released February 1998.

Acceptability of Printed Boards

Contains full-color photographs and illustrations of preferred, acceptable and rejectable conditions for plated through-holes, surface plating, solder coating, base materials, etching, conductors, mechanical processes, flexible and multilayer boards; bow/twist, flat cable and other conditions of printed wiring boards. 133 pages. Revised August 1995.

Printed Board Quality Evaluation Handbook

A reference guide containing color photographs of various anomalies and characteristics of printed wiring boards. This document contains a wide variety of photographic illustrations of various anomalies and characteristics of printed boards that can be used to identify those anomalies. that are sometimes seen during inspection and evaluation processes. The handbook has been broken down into fourteen distinct sections covering topics such as solder resist, plated through-holes, conductor characteristics and surface plating, all designed to aid the user in determining specific accept/nonconforming criteria for various anomalies. 52 pages. Released February 1999

Performance Specification for Metal Core Boards

Establishes the qualification and performance requirements for a metal core packaging interconnection (P/I) structure, referred to as a metal core board. Metal core boards consist of at least one conductive pattern on each side of an insulated metal substrate. Interconnection between conductive patterns are made using plated-through holes. The metal substrate is an integral part of the metal core board prior to interconnecting the conductive pattern. 50 pages. Released October 1988.

Qualification and Performance Specification for Mass Lamination Panels for Multilayer Printed Boards

This specification covers qualification and performance requirements of rigid mass laminated panels for use in multilayer printed boards, which will be fabricated for industry and government use of the requirements of IPC-6011 and IPC-6012. 11 pages. Released July 1994.

General Requirements for Encapsulated Discrete Wire Interconnection Boards

This specification establishes the qualification and performance requirements for encapsulated discrete wire interconnection boards, having wires that terminate in plated holes. 31 pages. Released January 1995.

Design and End Product Requirements for Discrete Wiring Boards
(Includes Amendment 1)

This standard covers design and end product requirements of discrete wiring boards, which utilize discrete wires to interconnect termination areas on or within flexible or rigid materials that may contain common on-board foil electrical conductors. 40 pages. Revised May 1990.

Specification for Multilayer Hybrid Circuits

Covers the qualification and performance requirements of multilayer circuits used in hybrid packaging. These circuits consist of three or more layers of conductor patterns separated from each other by insulating materials and interconnected by a continuous metallic interlayer connection. The substrate may include passive elements. 58 pages. Released January 1987.

Thermal Characteristics of Multilayer Interconnection Boards

This study was conducted to better understand the effects of different thermal environments on the reliability of copper PTHs. 20 pages. Released January 1974

Results of Multilayer Test Program Round Robin

This report, the fifth in a series of round test programs, was designed to collect and evaluate data on multilayer boards and the effects of materials and processing on MLB reliability. 86 pages. Released April 1981

Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components

This test report is a compendium of technical methods and techniques used for evaluating the quality aspects of present and future interconnection products and electronic assemblies. The handbook addresses base materials, conductor physical requirements, internal planes, construction, registration, plated through-holes, component mounting areas, cleaning evaluation, solder mask, and printed board electrical requirements. 104 pages. Released July 1993.

Leading Edge Manufacturing Technology Report

This report details the results of a round robin study on minimum conductor width and plated-through holes in rigid, bare copper, double-sided printed wiring boards. 62 pages. Released September 1984.

Round Robin Reliability Evaluation of Small Diameter Plated-Through Holes in PWBs

Approximately 200,000 PTHs covering primarily electroplated but also electroless technology were exposed to several different thermal cycles. A number of PTH diameters, board constructions and plating thicknesses were evaluated. 80 pages. Released September 1988.

Qualification and Performance of Polymer Thick Film Printed Boards

Covers the materials, qualification, certification and performance requirements for multilayer polymer thick film (PTF) printed, extrusion deposited, or otherwise applied conductor, insulator and through hole technology. This specification may also be used for procurement of single and double-sided boards. 23 pages. Released January 1987.