Specification for High Density Interconnect (HDI) and Microvia Materials

Covers the various conductive and dielectric materials that can be used for the fabrication of HDI and microvias. The 23 specification sheets included in IPC/JPCA-4104 specify the qualification and conformance requirements for such materials as photoimageable dielectric dry films and liquids, epoxy blends and coated foils. IPC/JPCA-4104 also includes six new test methods developed specifically or the testing of HDI and microvia materials. Released May 1999. 100 pages.

Qualification and Performance Specification for High Density Interconnect (HDI) Layers or Boards

Establishes the specific electrical, mechanical and environmental requirements for organic HDI layers with microvia technology. The acceptance criteria of the HDI layers are organized into specification sheets that reflect typical end-use applications, such as cellular phones, avionics, automotive and personal computers. For use with IPC-6011. 64 pages. Released May 1999.

Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules

This standard has been written for deposited organic interlayer dielectric materials under evaluation for MCM-D applications. The standard and test methods have been written without bias towards any particular class of materials. 36 pages. Released August 1995.