Design Guidelines for Electronic Packaging Utilizing High-Speed Techniques

Provides guidelines for the design of high-speed circuitry. Topics include mechanical and electrical considerations and performance testing. 70 pages. Revised January 1995.

Microwave End Product Board Inspection and Test(With IPC-6011, supersedes IPC-HF-318A)

Covers end product inspection and test requirements for high frequency (microwave) printed boards for microstrip, stripline and multilayer stripline applications. 20 pages. Released January 1998.

Design Guide for Microwave Circuit Boards Utilizing soft Substrates

Addresses microwave circuitry, microwaves that apply to radio waves in the frequency range of 100 MHz to 30 GHz. It also applies to operations in the region where distributed constant circuits enclosed by conducting boundaries are used instead of conventional lumped-constant circuit elements. 26 pages. Released June 1995.

Controlled Impedance Circuit Boards and High Speed Logic Design

The goal in packaging is to transfer a signal from one device to one or more devices through a conductor. High-speed designs are designs in which the interconnecting properties affect circuit performance and require unique consideration. This guide is for printed board designers, packaging engineers, printed board fabricators and procurement personnel to foster common understanding of each area. 49 pages. Released April 1996.

Specification for Plastic Substrates, Clad or Unclad, for High Speed/High Frequency Interconnections

Covers the requirements for high speed/high frequency performance plastic substrate to be used primarily for the fabrication of printed wiring boards for microstrip, stripline and high-speed degital electrical and electronic circuits. Applies to substrate thickness defined in the specification sheets as measured only over the dielectric. 28 pages. Revised July 1992.