Resin Coated Metal for Printed Boards

Establishes the requirements for metal foils coated with a resin or composite of resins on one side, which are to be used for the fabrication of printed boards. Also included are a series of specification sheets, which outline engineering and performance data for resin-coated metal foil, indicating foil material type and resin type. 80 pages. Released September 1998.

Composite Metallic Material Specification for Printed Wiring Boards

Covers the requirements for copper/invar/copper (CIC), copper/molybdenum/copper (CMC) and three-layer composites for use in electronic applications. IPC-CF-152B includes specification sheets, which outline engineering and performance data and provide a number for ordering purposes. 18 pages. Revised January 1994.

Metal Foil for Printed Wiring Application
(Includes Amendment 1)

Covers monolithic metal foils, either supported by carrier films or foils, or unsupported, suitable for subsequent use in printed boards. 17 pages. Revised October 1991. Amendment 1 released August 1992.

Results of IPC Copper Foil Ductility Round Robin Study

This test report evaluates ductility of the foils provided by the industry's copper foil vendors. 23 pages. Released April 1986.

Results of Copper Foil Rupture Strength Test Round Robin Study

This test report evaluates repture strength testing as a means for determining the mechanical properties of electrodeposited and rolled copper foil. 27 pages. Released March 1985.