Post Solder Solvent Cleaning Handbook

This handbook covers the following topics: cleaning solvents/solutions; properties of cleaning solvents; manufacturing residues; cleaning equipment and processes; cleaning of printed circuit assemblies after hand solder operations; process control; environmental considerations and safety. 18 pages. Released April 1997. Included in manual IPC-M-108.

Post-Solder Semiaqueous Cleaning Handbook

Describes manufacturing residues, types of semiaqueous cleaning agents, properties of semi-aqueous cleaning agents, semiaqueous cleaning processes and equipment, process and quality control, environmental controls and considerations, worker safety, cleanliness determination, measurement and cost. 21 pages. Released April 1995. Included in manual IPC-M-108.

Post-Solder Aqueous Cleaning Handbook

Describes manufacturing residues, types and properties of aqueous cleaning agents, aqueous cleaning processes and equipment, process and quality control, environmental controls and considerations, worker safety, cleanliness determination, measurement and cost. 37 pages. Released January 1996. Included in manual IPC-M-108.

Guidelines for Cleaning of Printed Boards and Assemblies

Covers materials residue types and all methods of cleaning contaminants off the board. Show relationship of contaminants, processes and equipment. Identifies physical properties of blends of aqueous and semiaqueous cleaners and features defection measures also. 54 pages. Released December 1990. Included in manual IPC-M-108.

Pre- and Post-Solder Mask Application Cleaning Guidelines

Covers all aspects of cleaning related to solder mask application, including board preparation, in-process control and maintenance of cleanliness during pre-assembly processes. 29 pages. Released April 1990. Included in manual IPC-M-108.

Surface Insulation Resistance Handbook

Covers the broad spectrum of temperature-humidity (TH) testing, associated terminology and suggested techniques for proper testing. Primarily addresses test methods used in the U.S. 65 pages. Released August 1996. Included in manual IPC-M-108.

Assembly Cleaning Guides and Handbooks

This convenient set includes the latest editions of all the IPC cleaning guides and handbooks. It will assist manufacturing engineers when making decisions on what cleaning products to use for troubleshooting their process. Save 45% off individual document prices!

The set includes:
• IPC-SC-60...Post Solder Solvent Cleaning handbook
• IPC-SA-61...Post Solder Semiaqueous Cleaning Handbook
• IPC-AC-62A...Post Solder Aqueous Cleaning Handbook
• IPC-CH-65...Guidelines for Cleaning of Printed Boards and Assemblies
• IPC-SM-839... Pre and Post Solder Mask Application Cleaning Guidelines
• IPC-9201....Surface Insulation Resistance Handbook.

Hard Copy:
IPC Members: $75
Nonmembers: $150

Surface Insulation Resistance

This single-sided (4 up) pattern is used for evaluating the interaction of solder flux and solder paste residues on printed boards. This board was used in the Phase 3 portion of the test program evaluating alternative technologies used to eliminate CFCs in printed board assembly operations. The board contains four comb patterns with 0.4 mm lines and 0.5 mm spaces. A stencil pattern is also provided (2 pcs 30 x 45 cm 1:1) No components are provided for this artwork. Available in film and electronically in Gerver. If ordering Gerber please specify electronic format IPC-A-24. For prefabricated boards, contact IPC for a list of vendors

Film:
IPC Members: $65
Nonmembers: $130

Cleaning and Cleanliness Testing Program Test Results for: Phase 3 - Low Solids Fluxes and Pastes Processed in Ambient Air

This document details the test procedures, test results and team conclusions for the IPC Cleaning and Cleanliness Testing Program, Phase 3, Low Solids Flux in Ambient Air. This effort has been part of a multi-stage program to investigate materials and process alternatives to the use of chlorofluoro-carbons (CFCs) in electronics manufacuturing. This Phase 3 effort has been dedicated to characerizing the cleanliness aspects of low solids fluxes, sometimes refferred to as "no-clean" fluxes, when used in an ambient air (non-inerted) reflow or wave solder application. 163 pages. Released November 1994.

IPC Members: $20