Moisture/Reflow Sensitivity Classification for Plastic Integrated Circuit Surface Mount Devices (Supersedes IPC-SM-786A)

The purpose of this standard is to identify the classification level of non-hermetic solid state surface mount devices that are sensitive to moisture-induces stress. They can be properly packaged, stored, and handled to avoid subsequent thermal / mechanical damage during the assembly solder reflow attachment and/or determine what classifi-cation level should be used for initial reliability qualification. 20 pages. Released April 1999. Included in manual IPC-M-109.

Standard for Handling, Packing, Shipping and Use of Moisture Reflow Sensitive Surface Mount Devices (Supersedes IPC-SM-786A)

Provides SMD manufacturers and users with stand-ardized methods for handling, packing, shipping and use of moisture/reflow sensitive SMDs. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degration. By using these procedures, safe and damage-free reflow can be achieved with the dry packing process, providing a minimum shelf life capability in sealed dry bags of 12 months from the seal date. 16 pages. Released April 1999. Included in manual IPC-M-109.

Acoustic Microscopy for Non-Hermetic Encaplsulated Electronic Components (Supersedes IPC-TM-650 method 2.6.22)

Provides SMD manufacturers and users with stand-ardized methods for handling, packing, shipping and use of moisture/reflow sensitive SMDs. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degration. By using these procedures, safe and damage-free reflow can be achieved with the dry packing process, providing a minimum shelf life capability in sealed dry bags of 12 months from the seal date. 16 pages. Released April 1999. Included in manual IPC-M-109.

Component Identification - Desk Reference Manual

Designers, buyers and assembly operators now have an immediate component identification resource at their workstations with the Component ID Desk Reference Manual. This comprehensive reference manual contains color photographs and full descriptions of more than 40 of the most commonly used through-hole and surface mount components, interconnections and hardware used in electronic assembly today. Also included is a terminology section with quick facts on polarity, orientation, lead styles and CRDs. The band reading section has full-color, easy-to-use code charts and other component value data. 64 pages. Released April 1998.

Component Identification Training on CD-ROM

Based on IPC's popular Component ID vedio (VT-18), the student is placed in the role of captain of a doomed starship who must salvage components from an abandoned spacecraft in order to save the ship. Using this setting, Component Quest first introduces the student to electronic components, including terminology, lead types, polarity, orientation and CRDs. Each of the training disk's four levels contain extensive exercises and a final test verifies comprehension. The administration section allows training administrators to track student performance and print completion certificates. (Run on any Windows Multimedia platform).

Components Handling Series

This set includes the latest editions of IPC standards and guidelines related to classification of components to moisture-sensitive, how to package, handle, store and test them, and additional documents to assure that the somponents will be compatible in your assembly process. Save 46% off individual document prices!

• IPC/JEDEC J-STD-020A...Moisture/Reflow Sensitivity Classification for Plastic Integrated Circuit Surface Mount Devices
• IPC/JEDEC J-STD-033....Standard for Handling, Packing, Shipping and Use of Moisture Reflow Sensitive Surface Mount Devices
• IPC/JEDEC J-STD-035....Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components
• IPC-9501...PWB Assembly Process Simulation for Evaluation of Electronic Components (Preconditioning IC Components)
• IPC-9502...PWB Assembly Soldering Process Guideline for Electronic Components
• IPC-9503...Moisture Sensitivity Classification for No-IC Components
• IPC-9504...Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components)

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PWB Assembly Process Simulation for Evaluation of Electronic Components (Preconditioning IC Components)

Will the components work with your process? That determintation is the goal of these manufacturing process simulation; to ensure that components chosen meet expected reliability requirements after exposure to factory processes. This document specifically addresses preconditioning of components. Developed for users and manufacturers, the procedure consists of a set of simulations for IC component storage and use, wave and reflow soldering (SMT and PTH parts), exposure to corrosive (water soluble) fluxes and exposure to often-used cleaning materials. 12 pages. Released July 1995. Included in manual IPC-M-109.

PWB Assembly Soldering Process Guideline for Electronic Components

This document describes manufacturing solder process limits that components subjucted to IPC-9501, IPC-9504 and J-STD-020 would survive. It does not include optinum conditions for assembly, but rather guides to assure components are not damaged. This document applies to both surface-mount (SM) and through-hole (TH) components that are wave soldered, reflowed or hand soldered. This document does not address the increased temperature requirements of lead-free solders. 12 pages. Released April 1999. Included in manual IPC-M-109.

Moisture Sensitivity Classification for Non-IC Components

The purpose of this standard is to identify the moisture sensitivity classification level of passive surface mount devices and through-hole components, subjected to reflow soldering, so that they can be properly packaged, stored, adn handled to avoid subsequent thermal/mechanical damage during the assembly solder reflow attachment and/or repair operation. This standard may be used to determine what classification level should be used for initial reliability qualification. 12 pages. Released April 1999. Included in manual IPC-M-109.

Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components)

This document specifically addresses preconditioning of non-IC components used in electronic assembly. Will the components work with your process? That determination is the goal of these manufacturing process simulations; to ensure that the components chosen meet expected reliability requirements after exposure to factory processes. Developed for users and manufacturers, the procedure consists of a set of simulations for non-IC component storage and use, wave and reflow soldering (SMT and PTH parts), exposure to corrosive (water soluble) fluxes and exposure to often-used cleaning materials. 19 pages. Released June 1998. Included in manual IPC-M-109.