Standard Pitch Stencil Pattern for Slump

Provided electronically, these Gerber files include patters for developing solder paste stencils by laser or chemical etching. Land widths of 0.4 mm, 0.63 mm and 1.25 mm are provided with varying pitch in order to evaluate solder paste slump. J-STD-005 included with each order. Available in Gerber data only.

Polymer Thick Film Artwork

Tests for registration, adhesion, interconnection resistance, insulation resistance, dielectric withstand voltage and thermal shock. Referenced in IPC-TF-870, (10 pcs. 20 x 25 cm 1:1) Available in film only.

Multipurpose 1&2 Sided Test Pattern

Referenced in IPC-CC-830 and IPC-SM-840C. Primarily for surface insulation resistance testing. Available in film or electronic IPC-D-350 or Gerber formats. (Film is 3 pcs. 30 x 46 cm scale 2:1) and includes solder mask master. Electronic format does not include the solder mask layer, but does include the drill file. Please specify format when ordering.

UL Recognition Test Pattern

Recognition vehicle for UL-796 and UL-746. Tests for conductor width plating quality-PTH, flammability, etc. (1 pc. 41 x 57 cm 1:1.). Available in three formats: film, electronically in Gerber and IPC-D-350 data. Please specify format when ordering.

Surface Insulation Resistance

This single-sided (4 up) pattern is used for evaluating the interaction of solder flux and solder paste residues on printed boards. This board was used in the Phase 3 portion of the test program evaluating alternative technologies used to eliminate CFC2 in printed board assembly operations. The board contains four comb patterns with 0.4 mm lines and 0.5 mm spaces. A stencil patterns is also provided (2 pcs 30 x 45 cm 1:1) No components are provided for this artwork. Available in film and electronically in Gerber. If ordering Gerber please specify electronic format IPC-A-24. For prefabricated boards, contact IPC for a list of vendors.