IPC National Technology Roadmap for Electronic Interconnections

The National Technology Roadmap provides vision and direction for product development, process development and services required to satisfy the current, near term and long term customer requirements for electronic interconnections.

The Roadmap presents findings and recommend-ations in the following areas: OEM requirements, encompassing infrastructure, printed board issues, assembly considerations, supporting interconne-ctions and beyond the roadmap. Each chapter contains specific recommendations addressing short-term, near-term and long-term requirements, proposed actions and opportunities. 280 pages. (To be revised in late 1999. Orders filled in 2000 will be for the 1999 edition.)

1998 Market for EMS Providers/Contract Assembly Companies

This comprehensive 68-page report analyzes the growing electronics manufacturing services market in the U.S. The report includes information on sources of revenue, analysis of finished products, automation, surface mount and fine pitch applications and size of orders. The report also details markets served, market trends, the size of the EMS market and the total available market. The report is based on data from 69 U.S. companies with sales of $8.7 billion, representing 39% of the independent assembly industry in the U.S. Released April 1999.

JPCA Roadmap

The Japan Printed Circuit Association (JPCA) published a 400-page "Report on the Technology Roadmap for Advanced System Integration and Packaging" in June 1998. Since Japan is a world leader in production of ultra-small, high-speed circuit packages, IPC has translated this report into English to make this information available to you.

This report is based on research conducted by the JPCA, providing guidance to the industry by defining the current state of circuit packaging technology in Japan and Asia and detailing plans for future market and technology trends through 2005.

The report concludes with a chapter on a wide variety of global forecasts for manufacturing electronic devices, projections of numbers of ICs mounted by product category and device type, projections of pin counts and the demand for printed wiring boards for electronic products, including MCMs and high-density multilayer boards. The IPC member price is less than 1% of what it would cost you company to translate this report on your own!

Technology Trends for Rigid Printed Wiring Boards

This 50-page report details trends in conductor width and spacing, hole processing, electrical and optical testing, metallic finishes and solder mask usage; and trends in multilayer production, surface mounting and fine pitch technology. The report summarizes data received from 69 U.S. independent PWB manufacturers with sales of 2.7 billion, representing 38% of the total market for independent PWB manufacturers. Released June 1999.