User's Guidelines for Automated Solder Joint Inspection Systems

Assists users in selecting automated solder joint inspection systems which best meet specific needs. 15 pages. Released January 1987.

Information Requirements for Manufacturing Electronic Assemblies

Covers information requirements for the procurement of material, assembly, inspection, test, burn-in and delivery of electronic assemblies. 5 pages. Released April 1991.

ESD Control Training on CD-ROM

ESD Control is a powerful, three-tier product designed for training assembly operators, technicians and other personnel who spend time on the production floor. There are two levels of training available, basic and advanced, which allow the training to be more closely matched to the individual's needs. These sections focus on the how-to's of ESD Control, such as preventing static charges, neutralizing charges and protecting devices from static fields. Each chapter contains a test module, along with a final certification test. The Resources Section includes the ESD Association's 175 page handbook, Advisory for Protection and Sensitivity Training of Electronic Discharge Susceptible Items, as well as articles, book excerpts, lists of organizations, book/periodical references, extensive glossary and index, designed to support the ESD Control Manager. (Runs on any Windows Multimedia platform.)

An Assessment of the Use of Lead in Electronic Assembly Surface Mount Council White Paper

As tin/lead solder is the most common material used to join conductors in electronic assembly, this document addresses many of the issues related to it. Concerns about legislation and regulation are addressed, specifically, "How serious is the hazard of lead?" Editor: Greg Munie, Lucent Technology. 28 pages. Released by the Surface Mount Council, August 1992.

EMSI Terms and Conditions Document

Since terms and conditions specified in contractual agreements can be difficult to understand and easy to misinterpret, IPC's EMSI Council has collected examples of some of the possible terms that can be part of a contract and compiled them into a single, easy to understand document. The document is divided into three sections: Overview of the Contract: Formation and Role of Terms and Conditions; Specific Terms and conditions: Clauses and Comments; and Specific Industry Terms and conditions.

Assembly Qualification Profile

Developed by the OEM council of the IPC, IPC-1720 categorizes as electronic assembly manufacturer's capabilities and supplies the OEM customer with detailed, substantive information. This program simplifies auditing processes and reduces the frequency of audits, thereby decreasing paperwork and improving efficiency. Company and Site Description, Site Capability Snap Shot, Equipment Profile (Pre-site Audit), Technology Profile Specifics, Quality Profile, Manufacturing History, Identification of Previous Audits, Financial Review (optional), AQP Electronic Data Format (Floppy Disk)

IPC-1720 is supplemented by a Microsoft Word electronic format, which contains identical information to the standard, and offers permanent electronic consolidation and organization of data. Improves the system of updating and transferring information between manufacturer and customer. 30 pages. Released June 1996.

Design and Application Guidelines for Surface Mount Connectors

Provides guidelines for the design, selection and application of soldered surface mount connectors for all types of printed boards, rigid, flexible-rigid and backplanes. 41 pages. Released January 1990.

Design and Application Guidelines for the Use of Solderless Surface Mount Connectors

Provides information on design characteristics and the application of solderless surface mount connectors including conductive adhesives, in order to aid IC package to board interconnection. 34 pages. Released January 1994.

Electrochemical Migration: Electrically Induced Failures in Printed Wiring Assemblies

This technical report provides information on an IPC program to identify/evaluate electromigration on PWBs. 14 pages. Revise June 1984.