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Publications '99-'00 for Printed circuit Boards, Design, and Electronics Assembly

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IPC-S-100 Manuals and CD-ROM

Standards and Specifications Manual

The most complete completion of IPC specifications is now available in hard copy and on CD-ROM. IPC-S-100 covers all aspects of electronic interconne-ction technology, from design through assembly and test. If you're just starting out, implementing a new procedure or considering a change from military standards, it covers all Newly revised to include the latest standards, it covers all aspects of electronic interconnection technology, from design through assembly and test. Two years updating (subscription) sevice is included for this manual. (CD-ROM users: Printing is disabled unless a site license is purchased.) Save 45% over individual document prices.
 
J-STD-001B Requirements for Soldered Electrical and Electronic Assemblies
J-STD-002A Solderability Tests for Component Leads, Termination, Lugs, Terminals and Wire.
J-STD-003 Solderability test for Printed Boards.
J-STD-004 Requirements for Soldering Fluxes
J-STD-005 Requirements for Soldering Pastes
J-STD-006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
J-STD-020A Moisture/Reflow Sensitivity Classifi-cation for Plastic Integrated Circuit Surface Mount Devices
J-STD-033 Standards for Handling, Packaging, Shipping and use of Moisture/Reflow Sensitive Surface Mount Devices
IPC-T-50F Terms and Definitions for Interconne-cting and Packaging Electronic Circuits
IPC-L-125A Specification for Plastic Substrates, Clad or Unclad, for High Speed/High Frequency Connections
IPC-DD-135 Qualification for Deposited Organic Interlayer Dielectric Materials for Multichip modules
IPC-EG-140 Specification for Finished Fabric Woven From "E" Glass For Printed Boards
IPC-SG-141

Specification for Finished Fabric Woven From "S" Glass For Printed Boards
IPC-A-142 Specificaiton for Finished Fabric Woven From Aramid For Printed Boards
IPC-QF-143 Specificaiton for Finished Fabric Woven From Quartz (Pure Fused Silica) For Printed Boards
IPC-CF-148A Resin Coated Metal For Printed Boards
IPC-MF-150F Metal Foil for Printed Wiring Applications
IPC-CF-152B Composite Metallic Material Specifi-cation for Printed Wiring Boards
IPC-FC-231C Flexible Bare Dielectrics for Use in Flexible Printed Wiring
IPC-FC-232C Specification for Adhesive Coated Dielectric films for Use as Cover Sheets for Flexible Printed Wiring
IPC-FC-241C Flexible Meta-Clad Dielectrics for Use in Fabrication of Flexible Printed Wiring
IPC-D-300G Printed Board Dimensions and Tolerances
IPC-D-322 Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes.
IPC-MC-324 Performance Specification for Metal Core Boards
IPC-D-325A Documentation Requirements for Printed Boards, Assemblies, and Support Drawings
IPC-D-326 Information Requirements for Manufacturing Electronic Assemblies
IPC-NC-349 Computer Numerical Control Formatting for Drillers and Routers
IPC-BP-421 General Specification for Rigid Printed Board Backplanes with Press-Fit Contacts
IPC-DW-424 General Specification for Encapsulat-ed Discrete Wire Interconnection Boards
IPC-DW-425A Design and End Product Require-ments for Discrete Wiring Boards
IPC-DW-426 Specifications for Assembly of Discrete Wiring
IPC-DR-570A General Specification for 1/8 Inch Diameter Shank Carbide Drills for Printed Boards
IPC-OI-645 Standard for Visual Optical Inspection Aids
IPC-QL-653 Qualification of Facilities that Inspect / Test Printed Boards, Components and Materials
IPC-SM-817 General Requirements for Dielectric Surface Mounting Adhesives
IPC-CA-821 General Requirements for Thermally Conductive Adhesives
IPC-CC-830A A Qualification and Performance of Electrical Insulating Compound for Printed Board Assemblies
IPC-SM-840C Qualification and Performance of Permanent Polymer Solder Mask
IPC-D-859 Design Standard for Thick Film Multilayer Hybrid Circuits
IPC-HM-860 Specification for Multilayer Hybrid Circuits
IPC-TF-870 Qualification and Performance of Polymer Thick Film Printed Boards
IPC-ML-960 Qualification and Performance Specification for Mass Lamination Panels for Multilayer Printed Boards
IPC-1902 / IEC 60097 Grid Systems for Printed Circuits
IPC-2221 Generic Standard on Printed Board Design
IPC-2222 Sectional Design Standard on Rigid PWB Design Boards
IPC-2223 Sectional Design Standard for Flexible Printed Boards
IPC-2224 Sectional Standard for Design of PWBs for PC Cards
IPC-2225 Sectional Design Standard for Organic Multichip Module (MCM-L) and MCM-L Assemblies
IPC-2511 Generic Requirements for Implement-ation of Product Manufacturing Description Data and Transfer Mechodology
IPC-2524 PWB Fabrication Data Quality Rating System
IPC-3406 Guidelines for Electrically Conductive Surface Mount Adhesives
IPC-3408 General Requirements for Anisotropi-cally conductive Adhesive Films
IPC-4101 Laminative/Prepreg Materials Standard for Printed Boards
IPC / JPCA-4101 Specification for High Density Inter-connect (HDI) and Microvia Materials
IPC-4110 Specification and Characterization Models for Nonwoven Cellulose Based Paper for Printed Boards
IPC-4130 Specification and Characterization Methods for Nonwoven "E" Glass Mat
IPC-4411 Specification and Characterization Methods for Nonwoven Para=Aramid Reinforcement
IPC-6013 Qualification and Performance Speci-fication for Flexible Printed Boards
IPC-6015 Qualification and Performance Speci-fication for Organic Multichip Module (MCM-L) Mounting and Interconnect-ing Structures
IPC-6016 Qualification and Performance Speci-fication for High Density Interconnect (HDI) Layers or Boards
IPC-6011 Generic Performance Specification for Printed Boards
IPC-6012 Qualification and Performance Speci-fication for Rigid Printed Boards
IPC-6018 Microwave End Product Board Inspection and Test
IPC/JPCA-6202 Performance Guide Manual for single and Double-Sided Flexible Printed Wiring Boards
Hard Copy: Electronic Format:
IPC Members: $600 IPC Members: $900
Nonmembers: $1200 Nonmembers: $1800

IPC-M-103

Standards for Surface Mount Assemblies Manual

IPC has taken the most requested documentation for surface mounting and packaged all 21 documents into one convenient set. It now includes standards to support working with moisture-sensitive components. as well as all the IPC adhesive documents. These documents are for anyone currently involved in or contemplating implementation of surface mounting. Save 43% over individual document prices!

Comprehensive Surface Mount Documentation:
IPC-T-50F Terms and Definitions for Interconnecting and Packaging Electronic Circuits
J-STD-001B Requirements for Soldered Electrical and Electronic Assemblies
J-STD-002A Solderability Tests for Component Leads, Termination, Lugs, Terminals and Wire.
J-STD-012 Implementation of Flip Chip and Chip Scale Technology
J-STD-013 Implementation of Ball Grid Array and Other High Density Technology
J-STD-020A Moisture/Reflow Sensitivity Classifi-cation for Plastic Integrated Circuit Surface Mount Devices
J-STD-033 Standard for Handling, Packing, Shipping and Use of Moisture Reflow Sensitive Surface Mount Devices
IPC-C-406 Design and Application Guidelines for Surface Mount Connectors
IPC-A-610B Acceptability of Printed Board Assemblies
IPC-CA-821 General Requirements for Thermally Conductive Adhesives
IPC-3406 Guidelines for Electrically Conductive Surface Mount Adhesives
IPC-3408 General Requirements for Anisotro-pically Conductive Adhesives Films
IPC-CM-770D Guidelines for Printed board Component Mounting
IPC-SM-780 Component Packaging and Interconnecting With Emphasis on Surface Mounting
IPC-SM-782A Surface Mount Design and Land Pattern Standard
IPC-SM-784 Guidelines for Chip-on-Board Technology Implementation
IPC-SM-785 Guidelines for Accelerated Reliability Testing of Surface Mount Attachments
IPC-MC-790 Guidelines for Multichip Module Technology Utilization
IPC-S-816 SMT Process Guideline and Checklist
IPC-SM-817 General Requirements for Dielectric Surface Mounting Adhesives
IPC-TR-001

An Introduction to Tape Automated Bonding Fine Pitch Technology

Hard Copy:
IPC Members: $300
Nonmembers: $600		 Electronic Format:
IPC Members: $450
Nonmembers: $900
 
IPC-M-104

Standards for Printed Board Assembly Manual

This conveniently packaged set contains 10 of the most widely used documents on printed board assembly. Save 36% over individual document prices.
 
Packaged set included:
J-STD-001B Requirements for Soldered Electrical and Electronic Assemblies
J-STD-002A Solderability Tests for Component Leads, Termination, Lugs, Terminals and Wire.
J-STD-003 Solderability test for Printed Boards.
J-STD-004 Requirements for Soldering Fluxes
J-STD-005 Requirements for Soldering Pastes
J-STD-006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
IPC-T-50F Terms and Definitions for Interconnecting and Packaging Electronic Circuits
IPC-D-326 Information Requirements for Manufacturing Electronic Assemblies
IPC-A-610B Acceptability of Printed Board Assemblies
IPC-CM-770D Guidelines for Printed board Component Mounting
Hard Copy:
IPC Members: $150
Nonmembers: $300		 Electronic Format:
IPC Members: $225
Nonmembers: $450

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