Incoming Inspection of Raw Materials Manual

Contains background information, applicable specification references and industry-approved test methods for inspection and evaluation of incoming raw materials. Material categories include laminates, multilayer board materials, various interconnection substrates, resists and other coatings, processing chemicals, artwork, registration tools, accessories, soldering materials, tooling accessories, and other materials. Released February 1984.

Requirements for Soldering Fluxes
(Includes Amendment 1)

Describes general requirements for classifying and testing of rosin, resin, organic and inorganic fluxes for high quality interconnections. This standard is a flux characterization, quality control and procurement document fro solder flux and flux-containing materials of all compositions, including no-clean. Supersedes QQ-S-571 and MIL-F-14256. Co-produced with EIA. 38 pages. Released January 1995. Amendment released April 1996.

Requirements for Soldering Pastes

Lists general requirements for characterization and test of metal content, viscosity, slump, solder ball, tack and wetting of solder pastes. (This is a quality control document and is not intended to relate directly to a material's performance in the manufacturing process.) Supersedes QQ-S-571. Co-produced with EIA. 38 pages. Released January 1995.

Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications

Describe requirements and test methods for electronic grade solder alloys, and for fluxed and non-fluxed bar, ribbon, and powder solders other than solder paste for electronic grade solders. Supersedes QQ-S-571 and MIL-F-14256. Co-produced with EIA. 32 pages. Released January 1995. Amendment 1 released June 1996.

The Layman's Guide to Qualifying New Fluxes for MIL-STD-2000A or MT-0002

Written by Doug Pauls of Contamination Studies Laboratories, this technical paper is an easily understood test document giving you practical guidance and technical pointers on how to demonstrate a new process capable of producing reliable hardware. 18 pages. Released July 1996.

Qualification and Performance of Permanent Solder Mask

Streamlines solder mask classes into two classifications: H (high reliability) and T (telecom-munications). IPC-SM-840C also integrates Bellcore requirements (class T) and provides minimum voltage breakdown, defines mask formulation latitude, adds new mask chemistries and more. 52 pages. Revised January 1996.

General Requirements for Dielectric Surface Mounting Adhesives

Covers requirements for dielectric adhesives. Includes test methods to ensure components adhere to the board and survive soldering processes. 18 pages. Released November 1989.

General Requirements for Thermally Conductive Adhesives

Covers requirements and test methods for paste type dielectric adhesives used to bond components in place and for their long term properties as part of the printed wiring board. It defines dielectric thermally conductive adhesives through a specification of test methods and inspection criteria. 18 pages. Released January 1995.

Guidelines for Electrically Conductive Surface Mount Adhesives

The IPC-3406 covers guidelines for selecting electrically conductive adhesives for use in assembly of components to printed circuit boards or similar wiring interconnect systems. The focus is on the use of adhesive as solder alternatives. The process discussion attempts to stay within the bounds of the existing solder assembly infrastructure. Both major types of adhesives, isotropic (conducting equally in all directions) and anisotropic (unidirectional conductivity) are covered. The two major divisions of polymer adhesives, thermosets and thermoplastics are described. 12 pages. Released July 1996.

General Requirements for Anisotropically Conductive Adhesives Films

This document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components and for their long term properties as part of the printed wiring board assembly. Applications include the following: flexible PWB-to-glass, flexible PWB-to-rigid PWB, flip chip-to-glass, flip chip-to-flexible PWB, flip chip-to-rigid PWB, and fine pitch SMD. The adhesive film may be supplied pre-attached to a flexible circuit or other product. 32 pages. Released November 1996.

Qualification and Performance of Electrical Insulating Compound for Printed Board Assemblies

This is the industry standard for qualifying conformal coating. It was designed and constructed with the intent of obtaining maximum information about the confidence in the electrical insulating compound (conformal coating) material under evaluation with a minimum of test redundancy. Includes evaluation of material properties and precedures to qualify a coating using the standard test board. 32 pages. Released October 1998.