Assembly and Joining Handbook

Contains over 500 pages describing proven techniques for assembly and soldering. Individual articales are developed by noted industry experts and reviewing by a standing committee. Sections include: terms and definitions; specification references and synopsis; design; printed wiring boards; component/lead types; joining materials; component mounting; solderability; joinging techniques and packaging; cleaning and coating; and quality assurance and testing. 336 pages. Revised August 1996.

Generic Training Plan

This set includes generic material that can be used to develop company-specific training courses. Material is included for both an instructor course and an operator/inspector course that will provide an understanding of the requirements of J-STD-001B. These building blocks are meant only to enhance internal company training efforts and their use does not result in IPC certification or industry recognition. Released April 1998. Includes both documents and 3 1/2" disk with electronic copy.

Technology Assessment Handbook on Soldering

This "best of" collection contains 45 of the best articles on all aspects of soldering selected by a panel of industry experts. This 400-page handbook contains articles from a variety of sources on the following topics: general soldering; soldering materials; manual soldering; mass soldering; wave soldering; reflow, vapor phase and infrared soldering. Also contains bibiographic information on dozens of other related articles. Released 1990.

Component Mounting Guidelines for Printed Boards

Demonstrates effective guidelines in the preparation of components for assembly of printed wiring boards and reviews pertinent design criteria, impacts and issues. Contains techniques for assembly (both manual and machines including SMT and flip chip) and consideration of, and impact upon, subsequent soldering, cleaning, and coating processes. 155 pages. Revised January 1996.

Guidelines for Accelerated Reliability Testing of Surface Mount Attachments

Provides guidelines for accelerated reliability testing of surface mount solder attachments for evaluating and extrapolating the results of these accelerated reliability tests towards actual use environments of electronic assemblies. 44 pages. Released November 1992.

Related documents for IPC-SM-785:
IPC-MC-279...Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies

Selection and Implementation Strategy for a Low-Residue, No-Clean Process

Provides direction to electronics manufacturers interested in adopting low residue (LR) assembly technology. It addresses the concerns of process engineers and others coming into the field of low-residue processes from two different areas: those who currently clean finished assemblies using water-based, semi-aqueous or other environmentally acceptable solvents and defluxing technologies; or those who use a standard residue-level (SR) no-clean assembly process. Both types of manufacturers should understand the advantages and pitfalls of using low-residue soldering materials. This guide allows electronics manufacturers to choose the process/materials that will best suit their needs. 120 pages. Released December 1998.

IPC Phase 3 Controlled Atmosphere Soldering Study

The IPC Phase 3 Controlled Atmosphere Soldering Study evaluated the use of nitrogen as an inerting blanket with two Low Residue fluxes in a no-clean mode. Additionally, two resin fluxes using ambient atmosphere cleaned with methyl chloroform solvent served as controls. The IPC-B-24 served as the test vehicle. The test format evaluated flux materials in different configurations of clean vs. no-clean processing with the test combs both soldered and not soldered. 90 pages. Revised August 1994.

Technology Assessment Handbook on Surface Mounting

This "best of" collection contains 71 of the best articles on all aspects of surface mounting technology, as selected by a panel of industry experts. This 450-page handbook contains articles from a variety of sources on the following topics: general SMT overflow; packaging concepts; design considerations; packaging components; process materials; process considerations; quality assessments and reliability. Also contains bibiographic information on dozens of other related articles.

Component Packaging and Interconnecting with Emphasis on Surface Mounting

Examines key issues in advanced packaging techniques. Provides information on what types of parts are available, the techniques and processes necessary for their proper use, possible adbantages/ disadvantages or problems, how to start implementation and where to find additional information. 138 pages. Released March 1988.

SMT Process Guideline and Checklist

Why waste time looking for answers? This handy, easy-to-use troubleshooting guide lists all types of processing problems and solutions for surface mount assembly. Covers bridging, skips, misalignment, placement and more. 31 pages. Released July 1993.