Nepcon Shanghai 2001 - High-level Conference Schedule
Sponsored By:The Ministry of Information Industry (MII), China.
Organised By:CCPIT Electronics & Information Industry Sub-Council Reed Exhibition Companies

Date :14 - 16 May, 2001
Venue :Presentation Hall, Shanghai Everbright Convention and Exhibition Centre, International Hotel (66, Cao Bao Road, Xuhui District, Shanghai)
Sponsor :Agilent Technologies

May 14 Conference Schedule
2:00pm - 3:00pm
Press Conference for the 11th NEPCON/Microelectronics Shanghai 2001;
Opening Session for the High-level Conference
Opening Speech by Mr. Zhou Baoyuan, Deputy Director of General Office and Mr. Yuan Sutai, Director of Information Service, MII, China

3:10pm - 4:30pm
China¡¯s Electronics Development Trend
Speaker : Administration of Electronic-Information Products, MII

May 15 Conference Schedule
9:00am - 10:00am
Global Trend of Electronics Manufacturing
Speaker : Mr. Yi Jihui, Director, American SMTA

10:40am - 11:40am
Structural Process Testing of PCBAs
Speaker : Mr. Jonathan Upson, Senior Consultant, Agilent Technologies

1:30pm - 2:30pm
Green Product and Environmental Protection
Speaker : Mr. Liu Wanhua, General Manager, Beijing Jingying No Clean Flux Co., Ltd.
Mr. Gu Pimo, Chief Engineer, Beijing Jingying No Clean Flux Co., Ltd.

2:40pm - 3:40pm
Application and Development of SMT in New Century
Speaker : Mr. Kimio Tomita, General Manager, Sales & Administration (E.A.T.S.DN.), JUKI Corporation

3:45pm - 4:20pm
Flip Chip and Chip Scale Packaging Technologies : A Historical Perspective and Future Challenges
Speaker : Mr. Horatio Quinones, Chief Scientist, Asymtek

May 16 Conference Schedule
9:00am - 10:00am
Challenging SOC
Speaker : Mr. Hao Min, CEO, Shanghai Hua Hong IC Co., Ltd.

10:10am - 11:30am
(1)Fundamentals of Stencil Printing on CSP
Speaker : Mr. Alex Orbacedo, Application Manager, Speedline Technologies Asia
(2)Selective Soldering in an Electronics Environment
Speaker : Mr. Joseph Meissert, Product Business Manager, Electrovert, Speedline Technologies Asia

 

 

From: lawrence.chung@reedexpo.com.hk