Nepcon Shanghai 2001 - SEMINAR SCHEDULE

14 May
1000 - 1200
Topic : Silicone for Electronics
Speaker : Mr L.S. Li, AETS Specialist, Dow Corning
Venue : Seminar Room 1, Level 2, Shanghai Everbright Convention & Exhibition Centre

14 May
1000 - 1200
Topic : Thermal Management For High Power Component
Speaker : 3M China Ltd.
Venue : Shanghai Everbright Convention & Exhibition Centre
International Centre

14 May
1330 - 1530
Topic : Inspection as a Quality Control Process
Speaker : Shavi Spinzi, Director of Marketing, Orbotech Ltd.
Venue : Seminar Room 2, Level 2, Shanghai Everbright Convention & Exhibition Centre

14 May
1400 - 1630
Topic : Tape & Reel Solution For SMD Product in Semiconduct Industry
Speaker : 3M China Ltd.
Venue : Shanghai Everbright Convention & Exhibition Centre
International Centre

15 May
1000 - 1200
Topic : Intro. of AOI Series Products ¨C Omron Company Japan
Speaker : Mr Lei Bao Jia, Engineer, Omron (China) Co., Ltd.
Venue : Seminar Room 1, Level 2, Shanghai Everbright Convention & Exhibition Centre

15 May
1000 - 1200
Topic : Pb Free Soldering
Speaker : T. Kashimura, Deputy Manager, D.S.K. Corporation
Venue : Seminar Room 2, Level 2, Shanghai Everbright Convention & Exhibition Centre

15 May
1000 - 1200
Topic : Static Electricity & Electronics ¨C Myth Versus Fact
Speaker : 3M China Ltd.
Venue : Shanghai Everbright Convention & Exhibition Centre
International Centre

15 May
1330 - 1530
Topic : New Auto M.O.L.E.? Xpert System
Speaker : Mr. Wojtek Antoniak, ECD Inc.
Venue : Seminar Room 1, Level 2, Shanghai Everbright Convention & Exhibition Centre

15 May
1400 - 1600
Topic : Intro. of CP60LM & Latest trend of SMT
Speaker : Mr. Park Eun Young, Manager of Technical Planning Dept., Samsung Techwin Co., Ltd.
Venue : Seminar Room 2, Level 2, Shanghai Everbright Convention & Exhibition Centre

15 May
1400 - 1630
Topic : Bonding Solution For Device Structure
Speaker : 3M China Ltd.
Venue : Shanghai Everbright Convention & Exhibition Centre
International Centre

16 May
1000 - 1100
Topic : Module Type Pick & Place in Millenium
Speaker : Mr. Yoji Tsuchida, Yamagata Casio Co., Ltd.
Venue : Seminar Room 1, Level 2, Shanghai Everbright Convention & Exhibition Centre

16 May
1000 - 1200
Topic : Solution For PCB Interconnection
Speaker : 3M China Ltd.
Venue : Shanghai Everbright Convention & Exhibition Centre
International Centre

16 May
1100 - 1200
Topic : Lead Free Reflow Soldering
Speaker : Mr. Pierre LeMieux, BTU International
Venue : Seminar Room 1, Level 2, Shanghai Everbright Convention & Exhibition Centre

16 May
1330 - 1430
Topic : High Resolution X-Ray Inspection
Speaker : Mr. John Donaldson, GenRad Inc.
Venue : Seminar Room 1, Level 2, Shanghai Everbright Convention & Exhibition Centre

16 May
1400 - 1630
Topic : Electronic Clean Liquid ¨C New Technology & Application
Speaker : 3M China Ltd.
Venue : Shanghai Everbright Convention & Exhibition Centre
International Centre

16 May
1430 - 1530
Topic : CSP, Flip Chip Rework Technology
Speaker : Mr. Ray LaFleur, GenRad Inc.
Venue : Seminar Room 1, Level 2, Shanghai Everbright Convention & Exhibition Centre

16 May
1400 - 1600
Topic : Challenge of high accuracy & Stability placement ¨C YAMAHA Xg series
Speaker : Mr. Yoshihisa Iwatsuka, Yamaha-Motor Co., Ltd.
Venue : Seminar Room 2, Level 2, Shanghai Everbright Convention & Exhibition Centre

From: lawrence.chung@reedexpo.com.hk