 |
|
|
|
Summary of Key Component, Material, Process and Design Standards (USA)
|
|
|
Standard Organizations The following documents on surface mount technology have been developed by U.S. and international standards organizations. The letter prefix of each document indicates the organization responsible for that document. |
|
| EIA | -Electronic Industries Association |
| JEDEC | -Joint Electron Devices Engineering Council of the EIA |
| IPC | -Institute for Interconnecting and Packaging Electronic Circuits |
| MIL | -Military |
| DoD | -Department of Defense |
| J-STD | -Joint Industry Standards |
Components, General |
|
| EIA-886-E* | Standard Test Methods for Passive Electronic Component Parts - General Instructions and Index |
| EIA-481-A | Taping of Surface Mount Components for Automatic Placement |
| EIA-481-1 | 8mm and 12mm Taping of Surface Mount Components for Automatic Handling |
| EIA-481-2 | 16mm and 24mm Embossed Carrier Taping of Surface Mount Components for Automated Handling |
| EIA-481-3 | 32mm, 44mm, and 56mm Embossed Carrier Taping of Surface Mount Components for Automated Handling |
| EIA/IS-47 | Contact Termination Finish Standard for Surface Mount Devices |
| EIA-PDP-100 | Registered and Standard Mechanical Outlines for Electronic Parts |
| EIA-JEP-95 | JEDEC Registered and Standard Mechanical Outlines for Semiconductor Devices |
| EIA-JESD30 | Descriptive Designation System for Semiconductor Device Packages |
| EIA-JESD95-1 | Design Requirements for Outlines of Solid-State and Related Products |
| IPC-3001 | Component Qualification for the Assembly Process |
| IPC-SM-786 | Recommended Procedure for Handling of Moisture
Sensitive Plastic IC Packages |
| * This document is an umbrella document that consists of a series of uniform test methods for Electronic Component Parts. | |
Components, Passive Capacitors |
|
| EIA-198-D | Ceramic Dielectric Capacitors Classes I, II, III, and IV |
| EIA-469-B | Standard Test Method for Destructive Physical Analysis of High Reliability Ceramic Monolithic Capacitors |
| EIA-479 | Film-Paper, Film Dielectric Capacitors for Microwave Ovens |
| EIA-510 | Standard Test Method for Destructive Physical Analysis of Industrial Grade Ceramic Monolithic Capacitors |
| EIA-535 | Series of Detail Specifications on Fixed Tantalum Capacitors that have been adopted by the National Electronic Components Quality (NECQ) Assessment System |
| EIA-CB-11 | Guidelines for the Surface Mounting of Multilayer Ceramic Chip Capacitors |
| EIA/IS-28 | Fixed Tantalum Chip Capacitor Style 1 Protected - Standard Capacitance Range |
| EIA/IS-29 | Fixed Tantalum Chip Capacitor Style 1 Protected - Extended Capacitance Range |
| EIA/IS-35 | Two-Pin Dual In-Line Capacitors |
| EIA/IS-36 | Chip Capacitors, Multi-Layer (Ceramic Dielectric) |
| EIA/IS-37 | Multiple Layer High Voltage Capacitors (Radial Lead Chip Capacitors) |
| EIA/IS-38 | Radial Lead Capacitors (Conformally Coated) |
| EIA/IS-39 | Ceramic Dielectric Axial Capacitors Glass Encapsulated) |
| IEC-384-3 | Sectional Specification, Tantalum Chip Capacitors |
| IEC-384-10 | Sectional Specification, Fixed Multilayer Ceramic Chip Capacitors |
| IECQ Draft | Blank Detail Specification, Fixed Multilayer Ceramic Chip Capacitors |
| IECQ-PQC-31 | Sectional Specification, Fixed Tantalum Chip Capacitors with Solid Electrolyte |
| IECQ-PQC-32 | Blank Detail Specification, Fixed Tantalum Chip Capacitor |
Resistors |
|
| EIA-575 | Resistors, Rectangular, Surface Mount, General Purpose |
| EIA-576 | Resistors, Rectangular, Surface Mount, Precision |
| EIA/IS-34 | Leaded Surface Mount Resistor Networks Fixed Film |
Components, Active |
|
| EIA-JEP-95 | JEDEC Registered and Standard Outlines for Semiconductor Devices |
| EIA-JESD11 | Chip Carrier Pinouts Standardized for CMOS 4000, HC, and HCT Series of Logic Circuits |
| EIA-JESD21-C | Configurations for Solid State Memories |
| EIA-JESD22-B | Test Methods and Procedures for Solid State Devices Used in Transportation/Automotive Applications Series format--consists of over 16 different test procedure documents.) |
| EIA-JESD-26A | General Requirements, PEM, Rugged Environments |
| EIA-JESD30 | Descriptive Designation System for Semiconductor Device Packages |
| EIA-JESD95-1 | Design Requirements for Outlines of Solid-State and Related Products |
Components, Electromechanical Connectors |
|
| EIA-429 | Industry Standard for Connectors, Electrical Flat Cable Type (IPC-FC-218B) |
| EIA-364-B | Electrical Connector Test Procedures Including Environmental Classifications (Series format consisting of over 60 Electrical Connector test procedures.) |
| EIA-506 | Dimensional and Functional Characteristics Defining Sockets for Leadless Type A Chip Carriers (.050 Spacing) |
| EIA-507 | Dimensional Characteristics Defining Edge Clips for Use with Hybrid and Chip Carriers |
| EIA/IS-47 | Contact Termination Finish Standard for Surface Mount Devices |
| EIA/IS-64 | Two Millimeter, Two-Part Connectors for Use with Printed Boards and Backplanes |
Sockets |
|
| EIA-5400000 | Generic Specification for Sockets for Integrated Circuit (IC) Packages for Use in Electronic Equipment (Series format with over 20 Sectional, Blank Detail & Detail Specifications, approved for use in the NECQ System.) |
Switches |
|
| IECQ-PQC-41 | Detail Specification, Dual-in-Line Switch, Surface |
| -US00003 | Mountable, Slide Actuated |
| EIA-448-23 | Surface Mountable Switches, Qualification Test |
| EIA-5200000-A | Generic Specification for Special-Use Electromechanical Switches of Certified Quality (Series format with over 25 Sectional, Blank Detail & Detail Specifications, approved for use in the NECQ System.) |
Printed Boards |
|
| IPC-FC-250 | Performance Specification for Single and Double-sided Flexible Printed Boards |
| IPC-RF-245 | Performance Specification for Rigid-Flex Multilayer Printed Boards |
| IPC-RB-276 | Performance Specification for Rigid Printed Boards |
| IPC-MC-324 | Performance Specification for Metal Core Boards |
| IPC-HM-860 | Performance Specification for Hybrid Multilayer |
| IPC-6301 | Performance Specification for Organic Multichip Module Structures (MCM-L) |
| MIL-P-50884 | Military Specification Printed Wiring, Flexible, and Rigid Flex |
| MIL-P-55110 | Military Specification Printed Wiring Boards, General Specification For |
| IPC-DW-425/424 | Discrete Wiring Technology |
| MIL-P-RRRRR | Printed Circuit Board/Printed Wiring Board Manufacturing, General Specification For |
Materials |
|
| IPC-L-108B | Specification for Thin Metal Clad Base Materials for Multilayer Printed Boards |
| IPC-L-109B | Specification for Resin Preimpregnated Fabric (Prepreg) for Multilayer Printed Boards |
| IPC-CC-110 | Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications |
| IPC-L-115B | Specification for Rigid Metal Clad Base Materials for Printed Boards |
| IPC-CF-148 | Resin Coated Metal for Multilayer Printed Boards |
| IPC-MF-150F | Metal Foil for Printed Wiring Applications |
| IPC-CF-152 | Metallic Foil Specification for Copper/Invar/Copper (CIC) for Printed Wiring and Other Related Applications |
| IPC-SM-817 | General Requirements for SMT Adhesives |
| IPC-CC-830 | Qualification and Performance of Electrical Insulation Compounds for Printed Board Assemblies |
| IPC-SM-840 | Qualification and Performance of Permanent Polymer Coating (Solder Mask) for Printed Boards |
| J-STD-004 | Requirements for Soldering Fluxes |
| J-STD-005 | General Requirements and Test Methods for Electronic Grade Solder Paste |
| J-STD-006 | General Requirements and Test Methods for Soft Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications |
Design Activities |
|
| IPC-D-249 | Design Standard for Flexible Single and Double-sided Printed Boards |
| IPC-D-275 | Design Standard for Rigid Printed Boards and Rigid Printed Board Assemblies |
| IPC-D-279 | Reliability Design Guidelines for Surface Mount Technology Printed Board Assemblies |
| IPC-D-317 | Design Standard for Electronic Packaging Utilizing High Speed Techniques |
| IPC-C-406 | Design and Application Guidelines for Surface Mount Connectors |
| IPC-SM-782 | Surface Mount Land Patterns (Configuration and Design Rules) |
| IPC-H-855 | Hybrid Microcircuit Design Guide |
| IPC-D-859 | Design Standard for Multilayer Hybrid Circuits |
| IPC-2301 | Design Standard for Organic Multichip Modules(MCM-L) and MCM-L Assemblies |
| Design Standard for Flexible Printed Wiring | |
Component Mounting |
|
| EIA-CB-11 | Guidelines for the Surface Mounting of Multilayer Ceramic Chip Capacitors |
| IPC-CM-770 | Guidelines for Printed Board Component Mounting |
| IPC-SM-784 | Guidelines for Direct Chip Attachment |
| SMC-TR-001 | An Introduction to Tape Automated Bonding and Fine Pitch Technology |
| IPC-SM-780 | Electronic Component Packaging and Interconnection with Emphasis on Surface Mounting |
| J-STD-012 | Implementation of Flip Chip and Scale Chip Technology |
| J-STD-013 | Implementation of Ball Grid Array and other High Density Technology |
Soldering and Solderability |
|
| EIA/IS-46 | Test Procedure for Resistance to Soldering (Vapor Phase Technique) for Surface Mount Devices |
| EIA/IS-49-A | Solderability Test Method for Leads and Terminations |
| EIA-448-19 | Method 19 Test Standard for Electromechanical Components Environmental Effects of Machine Soldering Using a Vapor Phase System |
| IPC-TR-460A | Trouble Shooting Checklist for Wave Soldering Printed Wiring Boards |
| IPC-TR-462 | Solderability Evaluation of Printed Boards with Protective Coatings Over Long-term Storage |
| IPC-TR-464 | Accelerated Aging for Solderability Evaluations |
| J-STD-001 | Requirements for Soldered Electrical and Electronic Assemblies |
| J-STD-002 | Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires |
| J-STD-003 | Solderability Tests of Printed Boards |
| IPC-S-816 | Troubleshooting for Surface Mount Soldering |
| IPC-AJ-820 | Assembly and Joining Handbook |
Quality Assessment |
|
| EIA-469-B | Standard Test Method for Destructive Physical Analysis of High Reliability Ceramic Monolithic Capacitors |
| EIA-510 | Standard Test Method for Destructive Physical Analysis of Industrial Grade Ceramic Monolithic Capacitors |
| IPC-A-600 | Acceptability of Printed Boards |
| IPC-A-610 | Acceptability of Printed Board Assemblies |
| MIL-STD-883 | Methods and Procedures for Microelectronics |
| IPC-TR-551 | Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components Reliability |
| IPC-A-24 | Flux/Board Interaction Board |
| IPC-A-36 | Cleaning Alternatives Artwork |
| IPC-A-38 | Fine Line Round Robin Test Pattern |
| IPC-A-48 | Surface Mount Artwork |
| IPC-AI-640 | User Requirements for Automatic Inspection of Unpopulated Thick Film Hybrid Substrates |
| IPC-AI-641 | User Guidelines for Automated Solder Joint Inspection Systems |
| IPC-AI-642 | User Guidelines for Automated Inspection of Artwork and Innerlayers |
| IPC-AI-643 | User Guidelines for Automatic Optical Inspection of Populated Packaging and Interconnection |
Surface Mount Process |
|
| IPC-SC-60 | Post Solder Solvent Cleaning Handbook |
| IPC-SA-61 | Post Solder Semi Aqueous Cleaning Handbook |
| IPC-AC-62 | Post Solder Aqueous Cleaning Handbook |
| IPC-TR-580 | Cleaning and Cleanliness Test Program Phase 1 Test Results |
| IPC-SM-785 | Guidelines for Accelerated Surface Mount Attachment Reliability Testing |
Numerical Control Standards |
|
| IPC-NC-349 | Computer Numerical Formatting for Drilling and Routing Equipment |
| IPC-D-350D | Printed Board Description in Digital Form - } |
| IEC-1182-1 | Printed Board Description in Digital Form - } Companion Documents |
| IPC-D-351 | Printed Wiring Documentation in Digital Form |
| IPC-D-352 | Electronic Design Database Description for Printed Boards |
| IPC-D-354 | Library Format Description for Printed Boards in Digital Form |
| IPC-D-356 | Bare Board Electrical Test Information in Digital Form |
| EIA-224-B | Character Code for Numerical Machine Control Perforated Tape |
| EIA-227-A | One-Inch Perforated Tape |
| EIA-267-B | Axis and Motion Nomenclature for Numerically Controlled Machines |
| EIA-274-D | Interchangeable Variable Block Data Format for Positioning, Contouring, and Contouring/Positioning Numerically Controlled Machines |
| EIA-281-B | Electrical and Construction Standards for Numerical Machine Control |
| EIA-358-B | Subset of American National Standard Code for Information Interchange for Numerical Machine Control Perforated Tape |
| EIA-408 | Interface Between Numerical Control Equipment on Data Terminal Equipment Employing Parallel Binary Data Interchange |
| EIA-431 | Electrical Interface Between Numerical Control and Machine Tools |
| EIA-441 | Operator Interface Function of Numerical Controls |
| EIA-474 | Flexible Disk Format for Numerical Control Equipment Information Interchange |
| EIA-484 | Electrical and Mechanical Interface Characteristics and Line Control Protocol Using Communication Control Characters for Serial Data Link Between a Direct Numerical Control System and Numerical Control Equipment Employing Asynchronous Full Duplex Transmission |
| EIA-494 | 32 BIT Binary CL Exchange (BCL) Input Format for Numerically Controlled Machines |
Test Methods |
|
| EIA-JEDEC | Method B 105-A, Lead Integrity - Plastic Leaded Chip Carrier (PLCC) Packages |
| EIA-JEDEC | Method B 102, Surface Mount Solderability Test(JESD22-B) |
| EIA-JEDEC | Method B 108, Coplanarity (intended for inclusion into JESD 22-C) |
| IPC-TM-650 | Test Methods Manual |
Repair |
|
| IPC-R-700C | Guidelines for Repair and Modification of Printed Board Assemblies |
Terms and Definitions |
|
| IPC-T-50E | Terms and Definitions for Interconnecting and Packaging Electronic Circuits |
How to Obtain These Documents Following are addresses for the IPC, EIA and other sources for documents shown in this SMT listing: |
|
|
INSTITUTE FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS (IPC) ELECTRONIC INDUSTRIES ASSOCIATION (EIA) GLOBAL ENGINEERING DOCUMENTS Military documents are available from: STANDARDIZATION DOCUMENTS Central Office of the IEC: INTERNATIONAL ELECTROTECHNICAL COMMISSION (IEC) IEC documents are available from: AMERICAN NATIONAL STANDARDS INSTITUTE (ANSI) |
|