Authors:
- Jay B. Hinerman, Senior Applications Engineer DEK, 8 Bartles Corner
Road, Flemington, New Jersey 08822.
- K. Srihari, Ph.D.,
Professor - Department of Systems Science and Industrial Engineering
State University of New York, Binghamton, New York 13902.
- George R. Westby, Director - Surface Mount Technology Laboratory
Universal Instruments Corporation, Binghamton, New York 13902-0825.
Abstract
The Alternative Assembly and Reflow Technology (AART) process allows
for the simultaneous reflow of both odd-form and through hole devices
as well as surface mount components. It offers several advantages over
the typical mixed technology process sequence that includes wave soldering
and/or hand soldering, often in addition to reflow soldering. Implementing
a high-yield AART process requires a scientific understanding and a
systematic examination of materials, design, and process related factors
on the formation of a 'proper' solder joint and on assembly reliability.
For example, solder paste selection and component resin choice are important
material characteristics. Component body design and stencil aperture
design are critical parameters in the design area. Finally, the reflow
profile and the placement method are important process parameters that
must be understood and controlled. This paper examines the entire AART
process. It is designed to provide a process engineer with some of the
knowledge necessary to implement a high-yield AART process. The AART
principles illustrated in this paper can be designed into a product
at the product design phase, or used as a 'drop-in' solution to an existing
PCB assembly.
This paper is available
in PDF format. Please down load.(uicaart.pdf.
file size: 280Kb)
(A 12/09/2000)
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