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By Wilhelm Prinz
von Hessen, Universal Instruments
Corporation, Binghamton, NY
Abstract
This paper reviews the implementation of a flip chip product in a typical
SMT production process. Several modifications in equip-ment, materials
and processes were required. Flip Chip is not just another package on
the board. A number of manufacturing related issues needed to be addressed.
Fluxing and Underfill processes were the most obvious areas. Additional
attention needed to be paid to yield and quality related issues. This
paper reviews these manufacturing issues and discusses how they were
solved for a specific product. The process development was performed
in partnership with a customer and Universal’s process lab and was based
on research results of the Advanced Process Lab.
This paper is available
in PDF format. Please down load.(uicflipchip.pdf.
file size: 210Kb)
(A 12/07/2000)
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