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By Jacques Coderre,
Universal Instruments Corporation Binghamton,
NY
and Karthik Vijayamadhavan, Binghamton University Binghamton, NY
Abstract
As the use of flux encapsulants increases, novel equipment solutions
are developed and introduced to handle such materials. Traditionally,
flux dispensing, chip placement and underfilling are performed as separate
operations. With the advent of flux encap-sulants, dispensing and placement
may be performed on the same machine. In this paper, equipment configurations
permitting the combined dispensing and placement of flip chips with
these novel products are presented. Machine characteristics such as
speed and accuracy are discussed. Impacts to the imaging process and
to the vision system in general are reviewed. Finally, dispensing valve
alternatives are compared and characterized as to their effectiveness
in dispensing flux encapsulants.
This paper is available
in PDF format. Please down load.(uicflux.pdf.
file size: 580Kb)
(A 12/07/2000)
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